Manufacturing method for an axially symmetric light-emitting diode assembly

• US 8,207,001 B2
• Filed: 09/23/2008
• Issued: 06/26/2012
• Est. Priority Date: 09/23/2008
• Status: Expired due to Fees

• Current Assignee: Helio Optoelectronics Corporation
• Original Assignee: Helio Optoelectronics Corporation
• Inventors: Chen, Ming-Hung, Chen, Jing-Yi
• Primary Examiner(s): Maldonado, Julio J
• Assistant Examiner(s): SHOOK, DANIEL P
• Application Number:
  US13/054,272
• Publication Number:
  US 20110165715A1
• Time in Patent Office: 1,372 Days
• Field of Search: 438/28, 438/26, 313/500, 257/88, 257/93, 257/E25.02, 257/E33.001, 257/E33.005, 257/E33.006, 257/E33.056, 257/E33.057
• US Class Current: 438/28
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.

Claims

1. A manufacturing method for an axially symmetric light-emitting diode assembly, the method comprising steps of:

providing a substrate, which has an central axis; and

forming a plurality of light-emitting areas on the substrate, wherein the light-emitting areas are arranged with axial symmetry around the central axis and insulated from each other, each said light-emitting area having one light-emitting diode and having dimensions the same as the corresponding light-emitting diode, and a plurality of the light-emitting diodes being electrically connected to each other;

wherein the substrate is provided with a plurality of trenches through an etching process by which the plurality of said light-emitting areas is defined and each of the trenches is capped by an insulation layer to insulate two said adjacent light-emitting areas.

2. The manufacturing method of claim 1, wherein the light-emitting areas are a plurality of round light-emitting areas.

3. The manufacturing method of claim 1, wherein each of the light-emitting areas is further divided into a plurality of equal-area, equidistant sub light-emitting areas, the light-emitting diode of the corresponding light-emitting area is divided, wherein the dimensions of each said divided light-emitting diode is the same as the dimensions of each said sub light-emitting area and the sub light-emitting areas have a same number of the light-emitting diodes.

4. The manufacturing method of claim 3, wherein each of the sub light-emitting areas is a non-rectangular sub light-emitting area.