Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
First Claim
1. A method of making a semiconductor chip assembly, comprising:
- providing a first post, a second post, a first adhesive, a second adhesive and a base, whereinthe first post is adjacent to the base, extends vertically from the base in a first vertical direction and extends into a first opening in the first adhesive,the second post is adjacent to the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and extends into a second opening in the second adhesive,the first adhesive contacts the base, extends vertically beyond the base in the first vertical direction and is non-solidified,the second adhesive contacts the base, extends vertically beyond the base in the second vertical direction and is non-solidified,the base is sandwiched between the posts and between the adhesives and extends laterally from the posts in lateral directions orthogonal to the vertical directions, andthe first post and the first opening are located within a periphery of the second post;
thenflowing the first adhesive;
flowing the second adhesive;
solidifying the adhesives;
thendepositing a first plated layer on the first post and the first adhesive, wherein the first plated layer covers the first post in the first vertical direction;
depositing a second plated layer on the second post and the second adhesive, wherein the second plated layer covers the second post in the second vertical direction;
providing a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the pad extends vertically beyond the base in the first vertical direction and includes a selected portion of the first plated layer, the terminal extends vertically beyond the base in the second vertical direction and includes a selected portion of the second plated layer, the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and an electrically conductive path between the pad and the terminal includes the electrical interconnect;
providing a heat spreader that includes the posts and the base;
thenmounting a semiconductor device on the first post, wherein the semiconductor device extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts and the first post is sandwiched between the semiconductor device and the base;
electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and
thermally connecting the semiconductor device to the first post, thereby thermally connecting the semiconductor device to the second post.
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Abstract
A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing and solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
53 Claims
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1. A method of making a semiconductor chip assembly, comprising:
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providing a first post, a second post, a first adhesive, a second adhesive and a base, wherein the first post is adjacent to the base, extends vertically from the base in a first vertical direction and extends into a first opening in the first adhesive, the second post is adjacent to the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and extends into a second opening in the second adhesive, the first adhesive contacts the base, extends vertically beyond the base in the first vertical direction and is non-solidified, the second adhesive contacts the base, extends vertically beyond the base in the second vertical direction and is non-solidified, the base is sandwiched between the posts and between the adhesives and extends laterally from the posts in lateral directions orthogonal to the vertical directions, and the first post and the first opening are located within a periphery of the second post;
thenflowing the first adhesive; flowing the second adhesive; solidifying the adhesives;
thendepositing a first plated layer on the first post and the first adhesive, wherein the first plated layer covers the first post in the first vertical direction; depositing a second plated layer on the second post and the second adhesive, wherein the second plated layer covers the second post in the second vertical direction; providing a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the pad extends vertically beyond the base in the first vertical direction and includes a selected portion of the first plated layer, the terminal extends vertically beyond the base in the second vertical direction and includes a selected portion of the second plated layer, the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and an electrically conductive path between the pad and the terminal includes the electrical interconnect; providing a heat spreader that includes the posts and the base;
thenmounting a semiconductor device on the first post, wherein the semiconductor device extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts and the first post is sandwiched between the semiconductor device and the base; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the first post, thereby thermally connecting the semiconductor device to the second post. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 51, 52)
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11. A method of making a semiconductor chip assembly, comprising:
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providing a first post, a second post, a first adhesive, a second adhesive, a first conductive layer, a second conductive layer and a base, wherein the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction, extends into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction, extends into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer, the first adhesive contacts the base, is sandwiched between the base and the first conductive layer, extends vertically beyond the base in the first vertical direction and is non-solidified, the second adhesive contacts the base, is sandwiched between the base and the second conductive layer, extends vertically beyond the base in the second vertical direction and is non-solidified, the first conductive layer extends vertically beyond the first adhesive in the first vertical direction, the second conductive layer extends vertically beyond the second adhesive in the second vertical direction, the base is sandwiched between the posts, between the adhesives and between the conductive layers and extends laterally from the posts in lateral directions orthogonal to the vertical directions, and the first post, the first opening and the first aperture are located within a periphery of the second post;
thenflowing the first adhesive in the first vertical direction into a first gap located in the first aperture between the first post and the first conductive layer; flowing the second adhesive in the second vertical direction into a second gap located in the second aperture between the second post and the second conductive layer; solidifying the adhesives, thereby mechanically attaching the first conductive layer to the first post and the base using the first adhesive and mechanically attaching the second conductive layer to the second post and the base using the second adhesive;
thendepositing a first plated layer on the first post, the first adhesive and the first conductive layer, wherein the first plated layer covers the first post in the first vertical direction; depositing a second plated layer on the second post, the second adhesive and the second conductive layer, wherein the second plated layer covers the second post in the second vertical direction; providing a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the pad extends vertically beyond the base in the first vertical direction and includes selected portions of the first conductive layer and the first plated layer, the terminal extends vertically beyond the base in the second vertical direction and includes selected portions of the second conductive layer and the second plated layer, the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and an electrically conductive path between the pad and the terminal includes the electrical interconnect; providing a heat spreader that includes the posts and the base;
thenmounting a semiconductor device on the first post, wherein the semiconductor device extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts and the first post is sandwiched between the semiconductor device and the base; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the first post, thereby thermally connecting the semiconductor device to the second post. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method of making a semiconductor chip assembly, comprising:
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providing a first post, a second post, a first adhesive, a second adhesive, a first conductive layer, a second conductive layer and a base, wherein the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction, extends into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction, extends into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer, the first adhesive contacts the base, is sandwiched between the base and the first conductive layer, extends vertically beyond the base in the first vertical direction and is non-solidified, the second adhesive contacts the base, is sandwiched between the base and the second conductive layer, extends vertically beyond the base in the second vertical direction and is non-solidified, the first conductive layer extends vertically beyond the first adhesive in the first vertical direction, the second conductive layer extends vertically beyond the second adhesive in the second vertical direction, the base is sandwiched between the posts, between the adhesives and between the conductive layers and extends laterally from the posts in lateral directions orthogonal to the vertical directions, and the first post, the first opening and the first aperture are located within a periphery of the second post;
thenflowing the first adhesive in the first vertical direction into a first gap located in the first aperture between the first post and the first conductive layer; flowing the second adhesive in the second vertical direction into a second gap located in the second aperture between the second post and the second conductive layer; solidifying the adhesives, thereby mechanically attaching the first conductive layer to the first post and the base using the first adhesive and mechanically attaching the second conductive layer to the second post and the base using the second adhesive;
thendepositing a first plated layer on the first post, the first adhesive and the first conductive layer, wherein the first plated layer covers the first post in the first vertical direction; depositing a second plated layer on the second post, the second adhesive and the second conductive layer, wherein the second plated layer covers the second post in the second vertical direction; providing a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the pad extends vertically beyond the first adhesive in the first vertical direction and includes selected portions of the first conductive layer and the first plated layer, the terminal extends vertically beyond the second adhesive in the second vertical direction and includes selected portions of the second conductive layer and the second plated layer, the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and an electrically conductive path between the pad and the terminal includes the electrical interconnect; providing a heat spreader that includes the posts, the base, a first cap, a second cap and selected portions of the conductive layers, wherein the first cap is adjacent to the first post, covers the first post in the first vertical direction, extends laterally from the first post and extends vertically beyond the first adhesive in the first vertical direction and includes selected portions of the first conductive layer and the first plated layer and the second cap is adjacent to the second post, covers the second post in the second vertical direction, extends laterally from the second post and extends vertically beyond the second adhesive in the second vertical direction and includes selected portions of the second conductive layer and the second plated layer;
thenmounting a semiconductor device on the first cap, wherein the semiconductor device extends vertically beyond the first cap in the first vertical direction and extends laterally within peripheries of the posts and the caps and the first post and the first cap are sandwiched between the semiconductor device and the base; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the first cap, thereby thermally connecting the semiconductor device to the second cap. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 53)
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41. A method of making a semiconductor chip assembly, comprising:
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providing a first post, a second post, a first adhesive, a second adhesive, a first conductive layer, a second conductive layer and a base, wherein the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction, extends into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction, extends into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer, the first adhesive contacts the base, is sandwiched between the base and the first conductive layer, extends vertically beyond the base in the first vertical direction and is non-solidified, the second adhesive contacts the base, is sandwiched between the base and the second conductive layer, extends vertically beyond the base in the second vertical direction and is non-solidified, the first conductive layer extends vertically beyond the first adhesive in the first vertical direction, the second conductive layer extends vertically beyond the second adhesive in the second vertical direction, the base is sandwiched between the posts, between the adhesives and between the conductive layers and extends laterally from the posts in lateral directions orthogonal to the vertical directions, and the first post, the first opening and the first aperture are located within a periphery of the second post;
thenapplying heat to melt the adhesives moving the conductive layers towards one another, thereby moving the first post in the first vertical direction in the first aperture, moving the second post in the second vertical direction in the second aperture, applying pressure to the molten first adhesive between the base and the first conductive layer and applying pressure to the molten second adhesive between the base and the second conductive layer, wherein the pressure between the base and the first conductive layer forces the molten first adhesive to flow in the first vertical direction into a first gap located in the first aperture between the first post and the first conductive layer and the pressure between the base and the second conductive layer forces the molten second adhesive to flow in the second vertical direction into a second gap located in the second aperture between the second post and the second conductive layer; applying heat to solidify the molten adhesives, thereby mechanically attaching the first conductive layer to the first post and the base using the first adhesive and mechanically attaching the second conductive layer to the second post and the base using the second adhesive;
thenproviding a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the pad includes a selected portion of the first conductive layer and extends vertically beyond the first adhesive in the first vertical direction, the terminal includes a selected portion of the second conductive layer and extends vertically beyond the second adhesive in the second vertical direction, the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and an electrically conductive path between the pad and the terminal includes the electrical interconnect; providing a heat spreader that includes the posts, the base, a first cap and a second cap, wherein the first cap is adjacent to the first post, covers the first post in the first vertical direction, extends laterally from the first post, extends vertically beyond the first adhesive in the first vertical direction and includes a selected portion of the first conductive layer and the second cap is adjacent to the second post, covers the second post in the second vertical direction, extends laterally from the second post, extends vertically beyond the second adhesive in the second vertical direction and includes a selected portion of the second conductive layer;
thenmounting a semiconductor device on the first cap, wherein the semiconductor device extends vertically beyond the first cap in the first vertical direction and extends laterally within peripheries of the posts and the caps and the first post and the first cap are sandwiched between the semiconductor device and the base; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the first cap, thereby thermally connecting the semiconductor device to the second cap. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification