Method for manufacturing a stretchable electronic device

• US 8,207,473 B2
• Filed: 06/24/2008
• Issued: 06/26/2012
• Est. Priority Date: 06/24/2008
• Status: Expired due to Fees

• Current Assignee: Universiteit Gent Vzw
• Original Assignee: IMEC International, Universiteit Gent Vzw
• Inventors: Axisa, Fabrice, Vanfleteren, Jan, Vervust, Thomas
• Primary Examiner(s): PAIK, SANG YEOP
• Application Number:
  US12/145,369
• Publication Number:
  US 20090317639A1
• Time in Patent Office: 1,463 Days
• Field of Search: 2191216-12172, 174/69, 174/254, 174/256, 174/258, 29846-849
• US Class Current: 219/121.72
• CPC Class Codes: B32B 2305/34 Inserts
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 37/185 Laminating sheets, panels or inserts between two discrete plastic layers
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material
• CPC Class Codes: H05K 2203/0264 Peeling insulating layer, e.g. foil, or separating mask
• CPC Class Codes: H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• CPC Class Codes: H05K 3/0032 of organic insulating material
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]

Abstract

A method for manufacturing a stretchable electronic device is disclosed. In one aspect, the device comprises at least one electrically conductive channel connecting at least two components of the device. The method comprises forming the channel by laser-cutting a flexible substrate into a predetermined geometric shape.

Claims

1. A method of manufacturing a stretchable electronic device comprising at least one electrically conductive channel connecting at least two electrical components, the channel having a predetermined geometric shape by which the channel is stretchable, the method comprising:

providing a flexible substrate comprising an insulating material and at least one layer of electrically conductive material on or embedded in the insulating material; and

cutting a predetermined geometric shape from the flexible substrate with laser, wherein the laser cutting cuts through the insulating material and the at least one layer of electrically conductive material together, thereby creating at least one stretchable conductive channel.

2. The method according to claim 1, wherein the method further comprises dividing at least one of the electrically conductive channels into two or more micro-channels.

3. The method according to claim 2, wherein the dividing of at least one of the electrically conductive channels is performed by laser-cutting through the geometric shape.

4. The method according to claim 1, wherein the method further comprises attaching the flexible substrate to a supporting layer before being laser patterned.

5. The method according to claim 4, wherein the supporting layer is laser cut together with the flexible substrate.

6. The method according to claim 4, wherein the method further comprises removing the supporting layer after laser-cutting the geometric shape from the flexible substrate.

7. The method according to claim 1, wherein the method further comprises removing any unused cut part of the at least one flexible substrate and the electrically conductive layer after being laser patterned.

8. The method according to claim 1, wherein the method further comprises embedding the stretchable electronic device in a polymer.

9. The method according to claim 5, wherein the method further comprises applying a first polymer layer on the stretchable electronic device at a side opposite of the supporting layer after being laser patterned.

10. The method according to claim 5, wherein the method further comprises applying a second polymer layer on the stretchable electronic device at the side of the supporting layer after being laser patterned and after removing the support layer.

11. The method according to claim 9, further comprising creating extra holes in the flexible substrate to improve the adhesion of the first and/or second polymer layers on the flexible substrate.

12. The method according to claim 11 wherein the size of the extra holes varies between about 100 μ

m and 500 μ

m.

13. The method according to claim 1, wherein the geometric shape is meander shaped.

14. The method according to claim 13, wherein the meanders have a horseshoe shape, the horseshoe channel having the shape of a circular segment and an angle with respect to a 0°

-baseline, a width and a diameter.

15. The method according to claim 14, wherein the angle is between about −

20° and

45°

.

16. The method according to claim 9 wherein laser cutting is performed under an angle different from 90°

with respect to the flexible substrate such that the geometric structures are anchored in the first polymer layer.

17. The method according to claim 9, wherein laser cutting is performed under an angle between about 30°

and 60°

with respect to the flexible substrate.

18. The method according to claim 1, wherein the flexible substrate comprises at least two electrically conductive layers, each of the electrically conductive layers alternating with electrically insulating layers.

19. The method according to claim 1, wherein the electrically conducting layer is patterned in the form of a macro-channel.

20. A stretchable electronic device as manufactured by the method according to claim 1.

21. The method according to claim 1, wherein the geometric shape is meander shaped in a plane parallel to a top surface of the substrate.

22. The method according to claim 1, wherein both the insulating material and the electrically conductive material are flexible.