Thin-film LED with P and N contacts electrically isolated from the substrate
First Claim
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1. A thin-film light emitting diode, comprising:
- an insulating substrate;
a conductive adhesive disposed directly on the insulating substrate;
a reflective metal electrode disposed directly on the conductive adhesive, wherein the conductive adhesive layer is metal and with the metal electrode together form a metallic current spreading layer, the metallic current spreading layer having a thickness greater than about 1 um; and
a single epitaxial structure on the electrode.
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Abstract
A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode.
145 Citations
12 Claims
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1. A thin-film light emitting diode, comprising:
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an insulating substrate; a conductive adhesive disposed directly on the insulating substrate; a reflective metal electrode disposed directly on the conductive adhesive, wherein the conductive adhesive layer is metal and with the metal electrode together form a metallic current spreading layer, the metallic current spreading layer having a thickness greater than about 1 um; and a single epitaxial structure on the electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification