Semiconductor chip assembly with base heat spreader and cavity in base

• US 8,207,553 B2
• Filed: 02/26/2010
• Issued: 06/26/2012
• Est. Priority Date: 03/25/2008
• Status: Expired due to Fees

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W. C., Wang, Chia-Chung, Lim, Sangwhoo
• Primary Examiner(s): Nadav, Ori
• Application Number:
  US12/714,421
• Publication Number:
  US 20100155769A1
• Time in Patent Office: 851 Days
• Field of Search: 257/99, 257/706, 257/707, 257/711, 257/712, 257/717
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a base; and

a conductive trace that includes a pad and a terminal;

wherein a cavity extends through the adhesive in the opening into the base, faces in the upward direction, has a diameter that decreases as it extends downwardly in the base and is covered by the base in the downward direction;

wherein the semiconductor device extends into the cavity and is covered by the cavity in the downward direction, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and contacts and extends above the base, extends between the cavity and the pad, extends laterally from the opening to or beyond the terminal and is sandwiched between the base and the pad;

wherein the opening has a diameter that increases as it extends downwardly;

wherein the conductive trace is located outside the cavity; and

wherein the base extends below the semiconductor device and the pad.

2. The assembly of claim 1, wherein the semiconductor device is located within the cavity.

3. The assembly of claim 1, wherein the semiconductor device is an LED chip.

4. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

5. The assembly of claim 1, wherein the adhesive is located above the base.

6. The assembly of claim 1, wherein the adhesive has a flat top surface at the opening and above a bottom surface of the pad.

7. The assembly of claim 1, wherein the adhesive conformally coats a top surface of the base outside the cavity.

8. The assembly of claim 1, wherein the adhesive contacts the terminal.

9. The assembly of claim 1, wherein the adhesive extends laterally from the opening beyond the terminal.

10. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

11. The assembly of claim 1, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

12. The assembly of claim 1, wherein the cavity has an inverted mushroom-like shape that includes a stem in the adhesive and a dome in the base.

13. The assembly of claim 1, wherein the cavity has a maximum diameter at an interface between the adhesive and the base where the cavity extends laterally along a bottom surface of the adhesive to the base.

14. The assembly of claim 1, wherein the base covers the semiconductor device, the adhesive and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

15. The assembly of claim 1, wherein the base and the terminal are the same metallic material, have the same thickness where closest to one another and are coplanar with one another at a surface that faces in the downward direction.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a base;

a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and

a conductive trace that includes a pad and a terminal;

wherein a cavity extends through the adhesive in the opening into the base, faces in the upward direction, extends into and below the aperture, has a diameter that decreases as it extends downwardly in the base and is covered by the base in the downward direction;

wherein the semiconductor device is located within the cavity, is mounted on the base, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, contacts the base and the dielectric layer, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, is sandwiched between the cavity and the dielectric layer in the gap and between the base and the dielectric layer outside the gap and extends laterally from the opening to or beyond the terminal and;

wherein the opening has a diameter that increases as it extends downwardly;

wherein the substrate is mounted on the adhesive and extends above the base;

wherein the conductive trace is located outside the cavity and the pad is mounted on and extends above the dielectric layer; and

wherein the base extends below the semiconductor device, the adhesive, the substrate and the pad.

17. The assembly of claim 16, wherein the semiconductor device is an LED chip.

18. The assembly of claim 16, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

19. The assembly of claim 16, wherein the adhesive is located above the base.

20. The assembly of claim 16, wherein the adhesive has a flat top surface at the opening and above a bottom surface of the pad.

21. The assembly of claim 16, wherein the adhesive fills the gap.

22. The assembly of claim 16, wherein the adhesive conformally coats a top surface of the base outside the cavity.

23. The assembly of claim 16, wherein the adhesive extends laterally from the opening beyond the terminal.

24. The assembly of claim 16, wherein the adhesive extends to peripheral edges of the assembly.

25. The assembly of claim 16, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

26. The assembly of claim 16, wherein the cavity has an inverted mushroom-like shape that includes a stem in the adhesive and a dome in the base.

27. The assembly of claim 16, wherein the cavity has a maximum diameter at an interface between the adhesive and the base where the cavity extends laterally along a bottom surface of the adhesive to the base.

28. The assembly of claim 16, wherein the base covers the semiconductor device, the adhesive, the substrate and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

29. The assembly of claim 16, wherein the substrate is spaced from the cavity and the base and is a laminated structure that includes the pad.

30. The assembly of claim 16, wherein the base and the terminal are the same metallic material, have the same thickness where closest to one another and are coplanar with one another at a surface that faces in the downward direction.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a base;

a substrate that includes a dielectric layer, wherein an aperture extends through the substrate;

a conductive trace that includes a pad and a terminal; and

an encapsulant;

wherein a cavity extends through the adhesive in the opening into the base, faces in the upward direction, extends into and below the aperture, has a diameter that decreases as it extends downwardly from in the base and is covered by the base in the downward direction;

wherein the semiconductor device is located within the cavity, is mounted on the base, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, contacts and is sandwiched between the encapsulant and the dielectric layer in the gap, contacts and is sandwiched between the base and the dielectric layer outside the gap, is sandwiched between the base and the pad outside the gap, extends above a bottom surface of the pad, is overlapped by the pad, extends laterally from the opening to or beyond the terminal and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity;

wherein the conductive trace is located outside the cavity and the pad contacts and extends above the dielectric layer and overlaps the adhesive;

wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and

wherein the base extends below the semiconductor device, the adhesive, the encapsulant, the substrate and the pad.

32. The assembly of claim 31, wherein the semiconductor device is an LED chip, is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

33. The assembly of claim 31, wherein the substrate is spaced from the cavity and the base, the adhesive fills the gap and conformally coats a top surface of the base outside the cavity, and the encapsulant contacts the semiconductor device and the adhesive in the cavity.

34. The assembly of claim 31, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

35. The assembly of claim 31, wherein the cavity has an inverted mushroom-like shape that includes a stem in the adhesive and a dome in the base and a maximum diameter at an interface between the adhesive and the base where the cavity extends laterally along a bottom surface of the adhesive to the base.