Method for manufacturing a touch screen sensor assembly

• US 8,209,861 B2
• Filed: 12/02/2009
• Issued: 07/03/2012
• Est. Priority Date: 12/05/2008
• Status: Active Grant

• Current Assignee: New Vision Display (Hong Kong) Limited (New Vision Display, Inc.)
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Long, Ding Hua, Zhang, Hai Long, Yu, Ying
• Primary Examiner(s): Phan, Thiem
• Application Number:
  US12/629,705
• Publication Number:
  US 20100139955A1
• Time in Patent Office: 944 Days
• Field of Search: 298/47, 295/921, 298/25, 298/29, 298/46, 174/126.4, 174/257, 174/258, 174/261, 345/160, 345/169, 345/173, 345/175, 345/179
• US Class Current: 29/847
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: G06F 3/047 using sets of wires, e.g. crossed wires
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A method for manufacturing a touch screen sensor assembly that includes providing a first transparent substrate, depositing a first non-metallic conductive layer onto the first substrate, removing the first conductive layer from a viewing portion of the first substrate, depositing a second non-metallic conductive layer onto the viewing portion, and removing portions of the second and first conductive layers to respectively form a first electrode pattern and a plurality of traces. The disclosed method also includes providing a second transparent substrate, depositing a third non-metallic conductive layer onto a viewing portion of the second substrate, removing portions of the third conductive layer to form a second electrode pattern, and bonding the first substrate to the second substrate using an optically clear adhesive. Each trace on the first substrate formed from the first conductive layer is electrically coupled to at least one electrode of either the first or second electrode patterns.

Claims

1. A method for manufacturing a touch screen sensor assembly, the method comprising:

providing a first transparent substrate;

depositing a first non-metallic conductive layer onto the first transparent substrate, wherein the first non-metallic conductive layer has a surface resistivity;

removing the first non-metallic conductive layer from the first transparent substrate in a viewing portion of the first transparent substrate, wherein the viewing portion corresponds to an area of the first transparent substrate that is to be aligned with a display;

depositing a second non-metallic conductive layer onto the viewing portion of the first transparent substrate, wherein the second non-metallic conductive layer has a surface resistivity that is higher than that of the first non-metallic conductive layer;

removing portions of the second non-metallic conductive layer from the first transparent substrate to form a first pattern of electrodes;

removing portions of the first non-metallic conductive layer from the first transparent substrate to form a plurality of traces;

providing a second transparent substrate;

depositing a third non-metallic conductive layer onto a viewing portion of the second transparent substrate, wherein the third non-metallic conductive layer has a surface resistivity that is substantially equal to that of the second non-metallic conductive layer;

removing portions of the third non-metallic conductive layer from the second transparent substrate to form a second pattern of electrodes; and

bonding the first transparent substrate to the second transparent substrate using an optically clear adhesive;

wherein each trace on the first transparent substrate formed from the first non-metallic conductive layer is electrically coupled to at least one electrode of either the first pattern of electrodes or the second pattern of electrodes.

2. The method of claim 1, further comprising:

providing a flexible printed circuit (FPC) connector having a plurality of electrical contacts; and

bonding the FPC connector to the first transparent substrate such that each trace is electrically coupled to at least one of the electrical contacts of the FPC connector.

3. The method of claim 2, wherein the FPC connector is bonded to the first transparent substrate using an anisotropic conductive film (ACF).

4. The method of claim 1, wherein at least one of the first, second, and third non-metallic conductive layers include indium tin oxide.