Solder containment brackets

• US 8,210,422 B2
• Filed: 09/30/2009
• Issued: 07/03/2012
• Est. Priority Date: 09/30/2009
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Zadesky, Stephen P.
• Primary Examiner(s): Stoner, Kiley
• Application Number:
  US12/571,295
• Publication Number:
  US 20110075388A1
• Time in Patent Office: 1,007 Days
• Field of Search: None
• US Class Current: 228/180.21
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 4/024 comprising preapplied solder
• CPC Class Codes: H01R 4/027 comprising means for positioning or holding the parts to be soldered or welded
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 428/24273 including aperture

Abstract

Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

Claims

1. A method, comprising:

soldering a solder containment bracket to a solder pad on a printed circuit board at a reflow temperature; and

soldering a wire in an enclosed solder region in the solder containment bracket at a soldering temperature that is less than the reflow temperature.

2. The method defined in claim 1 wherein the solder containment bracket comprises a planar base and at least one containment wall that extends vertically from the base and wherein soldering the solder containment bracket to the solder pad comprises attaching the planar base to the solder pad with solder.

3. The method defined in claim 2 wherein attaching the planar base to the solder pad with solder comprises:

forming a layer of solder paste on the solder pad; and

heating the solder paste to the reflow temperature.

4. The method defined in claim 1 wherein the solder containment bracket comprises at least one wall with an opening, the method further comprising:

inserting an end of the wire into the enclosed solder region in the solder containment bracket through the opening before soldering the wire.

5. The method defined in claim 1, wherein the solder containment bracket comprises a base and a wall, and wherein soldering the solder containment bracket to the solder pad comprises mounting the base of the solder containment bracket to the solder pad so that the wall protrudes upwards from the base and surrounds the enclosed solder region.

6. The method defined in claim 5 wherein the wall has an opening, the method further comprising:

receiving the wire through the opening into the enclosed solder region, wherein soldering the wire in the enclosed solder region comprises soldering the wire that has been received through the opening at the soldering temperature that is less than the reflow temperature.

7. The method defined in claim 1 where soldering the wire in the enclosed solder region comprises forming a solder joint between the wire and the solder containment bracket.

8. The method defined in claim 1, wherein the solder pad comprises a solder pad having a hole, and wherein soldering the solder containment bracket to the solder pad comprises soldering the solder containment bracket to the solder pad having the hole so that the hole of the solder pad is below the enclosed solder region.

9. The method defined in claim 1, wherein the solder pad comprises a rectangular trace without a hole, and wherein soldering the solder containment bracket to the solder pad comprises soldering the solder containment bracket to the rectangular trace without the hole.

10. The method defined in claim 1, wherein the solder containment bracket comprises a rectangular base and a cylindrical wall, and wherein soldering the solder containment bracket to the solder pad comprises mounting the rectangular base of the solder containment bracket to the solder pad so that the cylindrical wall protrudes upwards from the rectangular base and surrounds the enclosed solder region.

11. The method defined in claim 1, wherein the solder containment bracket comprises at least one wall with at least two openings, the method further comprising:

inserting the wire into the enclosed solder region in the solder containment bracket through the at least two openings before soldering the wire.

12. The method defined in claim 1, wherein the solder containment bracket comprises at least one wall with at least first and second openings, the method further comprising:

inserting an end of the wire into the enclosed solder region in the solder containment bracket through the first opening before soldering the wire.

13. The method defined in claim 12 further comprising:

inserting an end of an additional wire into the enclosed solder region in the solder containment bracket through the second opening.

14. The method defined in claim 13 further comprising:

soldering the additional wire in the enclosed solder region in the solder containment bracket at the soldering temperature.

15. The method defined in claim 1 wherein the solder containment bracket comprises at least one wall with a circular opening, the method further comprising:

inserting an end of the wire into the enclosed solder region in the solder containment bracket through the circular opening before soldering the wire.

16. The method defined in claim 1 wherein the solder containment bracket comprises at least one wall with a notch, the method further comprising:

inserting an end of the wire into the enclosed solder region in the solder containment bracket through the notch before soldering the wire.

17. The method defined in claim 1, wherein the solder pad comprises first and second contact pad regions, wherein the solder containment bracket comprises first and second bases, and wherein soldering the solder containment bracket to the solder pad comprises:

mounting the first base of the solder containment bracket on the first contact pad region; and

mounting the second base of the solder containment bracket on the second contact pad region.

18. The method defined in claim 17 where soldering the wire in the enclosed solder region comprises forming a solder joint between the wire and the solder containment bracket.

19. The method defined in claim 17 wherein soldering the solder containment bracket to the solder pad further comprises:

forming a first layer of solder paste on the first contact pad region;

forming a second layer of solder paste on the second contact pad region; and

heating the first and second layers of solder paste to the reflow temperature.

20. The method defined in claim 1, wherein the solder containment bracket comprises a base and a wall, and wherein soldering the solder containment bracket to the solder pad comprises:

with a pick and place machine, mounting the base of the solder containment bracket to the solder pad so that the wall surrounds the enclosed solder region.