Soldering entities to a monolithic metallic sheet

• US 8,210,424 B2
• Filed: 09/16/2010
• Issued: 07/03/2012
• Est. Priority Date: 09/16/2010
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Weibezahn, Karl S
• Primary Examiner(s): Stoner, Kiley
• Assistant Examiner(s): Gamino, Carlos
• Application Number:
  US12/883,750
• Publication Number:
  US 20120067412A1
• Time in Patent Office: 656 Days
• Field of Search: 2281791-18022, 228/249, 228/248.1, 228/251, 438613-618
• US Class Current: 228/248.1
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 3/0607 Solder feeding devices
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/83222 Induction heating, i.e. eddy currents
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/83815 Reflow soldering
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 31/022425 : for solar cells
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy
• CPC Class Codes: Y10T 428/24331 : including nonapertured component

Abstract

Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.

Claims

1. A method, comprising:

forming an aperture through a solid material, the solid material defined by a first side and a second side opposite the first side, the solid material being a monolithic metallic sheet;

providing a solder paste within the aperture;

disposing an entity in overlapping relationship with the aperture and in contact with the first side of the solid material; and

heating and then cooling the second side of the solid material so as to electromechanically bond the entity to the solid material by way of wicking at least a portion of the solder paste into contact with the entity.

2. The method according to claim 1, the providing the solder paste including supporting the solder paste within the aperture by way of surface tension alone for a period of time.

3. The method according to claim 1, the providing the solder paste including supporting the solder paste within the aperture by way of supportive contact with the entity.

4. The method according to claim 1, the entity being defined by an electronic device having a solderable surface feature, the solderable surface feature configured to remain external to the aperture during a life of the bond.

5. The method according to claim 1, the solid material including at least copper, silver, gold, brass, tin or aluminum.

6. The method according to claim 1, the heating performed by way of bringing a heated bar into temporary contact with the second side of the solid material.

7. The method according to claim 1 further comprising:

forming plural apertures through the solid material;

providing the solder paste within each of the plural apertures;

disposing plural entities in overlapping relationship with respective ones of plural apertures and in contact with the first side of the solid material; and

heating and then cooling the second side of the solid material so as to contemporaneously electromechanically bond the plural entities to the first side of the solid material by way of wicking the respective quantities of solder paste into contact with the respective entities.

8. The method according to claim 1, the providing the solder paste performed such that none of the solder paste extends outside of the aperture prior to the heating and then cooling.

9. A method of bonding an electronic entity to a conductive material, comprising:

forming a through aperture in the conductive material, the conductive material being a monolithic metallic sheet;

disposing a quantity of solder paste within the through aperture;

bringing the electronic entity into contact with a first side of the conductive material, the electronic entity having a solderable surface feature aligned with the through aperture;

heating a second side of the conductive material so as to reflow the solder paste into wetting contact with both the first side of the conductive material and the solderable surface feature; and

cooling the conductive sheet such that the electronic entity is electrically and mechanically bonded to the conductive material.

10. The method according to claim 9, the disposing including supporting the quantity of solder paste within the through aperture by way of surface tension alone.

11. The method according to claim 10, the forming performed such that the through aperture is defined by an internal step feature.

12. The method according to claim 9, the solderable surface feature remaining completely external to the through aperture throughout a lifetime of the bond.