Apparatus for thermal characterization under non-uniform heat load

• US 8,210,741 B2
• Filed: 11/03/2009
• Issued: 07/03/2012
• Est. Priority Date: 11/05/2004
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Hamann, Hendrik F., Iyengar, Madhusudan K., Lacey, James A., Schmidt, Roger R.
• Primary Examiner(s): Verbitsky, Gail
• Application Number:
  US12/611,519
• Publication Number:
  US 20100046574A1
• Time in Patent Office: 973 Days
• Field of Search: 374/4, 374/5, 374/29, 374/30, 374/43, 374/44, 374/45, 374/120, 374/121, 374/130, 374/137, 374/147, 374/141, 374/170, 374/171, 374/172, 374/173, 374/178, 374/110, 374/112, 374/163, 374/183, 374/167, 374/166, 374/39, 374/152, 702/130, 702/131, 702/132, 702/133, 702/134, 702/135, 702/136, 250/559.45, 250/559.46, 250/338.1, 250/559.34, 361/FOR.110, 257/467, 257/499, 324/759, 324/760, 324/761, 324/762, 324/763, 324/764, 324/765, 324/537, 32475001-75011, 32476201-76202
• US Class Current: 374/5
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

Claims

1. An apparatus for thermally characterizing an operational cooling device for an electronic device, the apparatus comprising:

an operational cooling device;

a laser for producing a laser beam for applying a focused heat to at least one localized region on the operational cooling device;

a system, coupled to the operational cooling device and to the laser, for moving the laser relative and the operational cooling device to more than one position relative to each other to direct the focused heat from the laser to more than one localized region of the operational cooling device;

a temperature detector for measuring a temperature distribution on the operational cooling device;

a test chip having a circuitry side and a side opposite the circuitry side, wherein the side opposite the circuitry side is thermally coupled to the operational cooling device; and

a bias heat source other than the test chip for applying, independently of the laser, a uniform heat to a larger area of the operational cooling device than the area of the at least one localized region.

2. The apparatus according to claim 1, wherein the operational cooling device comprises at least one of a heat pipe, a vapor chamber, a cold plate, a minichannel, a microchannel, and a fan/pump/compressor.

3. The apparatus according to claim 1, further comprising:

at least one beam splitting optical element for splitting the laser beam into at least two paths for applying the focused heat to a plurality of localized regions on the operational cooling device.

4. The apparatus according to claim 1, wherein the temperature detector comprises at least one of an infrared (IR) thermal imager, a fluorescence imager, and a charge-coupled device (CCD) camera.

5. The apparatus according to claim 1, wherein the operational cooling device is coated at least partially with a blackbody coating to enhance measurement of the temperature distribution.

6. An apparatus for thermally characterizing an operational cooling device for an electronic device, the apparatus comprising:

an operational cooling device;

a laser for producing a laser beam for applying a focused heat to at least one localized region on the operational cooling device;

a system, coupled to the operational cooling device and to the laser, for moving the laser relative and the operational cooling device to more than one position relative to each other to direct the focused heat from the laser to more than one localized region of the operational cooling device;

a temperature detector for measuring a temperature distribution on the operational cooling device;

a test chip having a circuitry side and a side opposite the circuitry side, wherein the side opposite the circuitry side is thermally coupled to the operational cooling device; and

a bias heat source other than the test chip for applying, independently of the laser, a uniform heat to a larger area of the operational cooling device than the area of the at least one localized region,

wherein the bias heat source comprises at least one of an ultraviolet (UV) lamp, a laser diode array, an electromagnetic radiator and a directed convective heat flow generator.

7. An apparatus for thermally characterizing an operational cooling device for an electronic device, the apparatus comprising:

an operational cooling device;

a laser for producing a laser beam for applying a focused heat to at least one localized region on the operational cooling device;

a system, coupled to the operational cooling device and to the laser, for moving the laser relative and the operational cooling device to more than one position relative to each other to direct the focused heat from the laser to more than one localized region of the operational cooling device;

a temperature detector for measuring a temperature distribution on the operational cooling device; and

a test chip having a circuitry side and a side opposite the circuitry side, wherein the side opposite the circuitry side is thermally coupled to the operational cooling device,

wherein the test chip includes a resistive heater for applying, independently of the laser, a uniform heat to a larger area of the operational cooling device than the area of the at least one localized region.

8. The apparatus according to claim 7, wherein the temperature detector measures temperature values on the operational cooling device when the laser and the operational cooling device are at each position of the more than one position relative to each other.