Semiconductor manufacturing method

• US 8,211,781 B2
• Filed: 11/10/2009
• Issued: 07/03/2012
• Est. Priority Date: 11/10/2008
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Saito, Tatsuma, Tanaka, Shinichi, Yokobayashi, Yusuke
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): THOMAS, TONIAE M
• Application Number:
  US12/615,277
• Publication Number:
  US 20100120228A1
• Time in Patent Office: 966 Days
• Field of Search: 438/458, 438/459, 438/463, 438/464, 438/977, 257/E21.238
• US Class Current: 438/458
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

A manufacturing method for semiconductor devices having a metal support is provided. The method in one aspect includes growing a semiconductor film on a growth substrate; forming a metal support on a surface of said semiconductor film opposite to the growth substrate; thereafter removing said growth substrate from said semiconductor film; forming a street groove reaching said metal support in the said semiconductor film; radiating a first laser beam onto said metal support to form a first dividing groove having a substantially flat bottom in said metal support; and radiating a second laser beam onto said metal support to form a second dividing groove that penetrates through a portion of said metal support that remains where the first dividing groove is formed.

Claims

1. A manufacturing method for semiconductor devices having a metal support, comprising:

growing a semiconductor film on a growth substrate;

forming a metal support on a surface of said semiconductor film opposite to the growth substrate;

thereafter removing said growth substrate from the said semiconductor film;

forming a street groove reaching said metal support in the said semiconductor film;

radiating a first laser beam onto said metal support that has been exposed at a bottom of said street groove to form a first dividing groove having a substantially flat bottom in said metal support; and

radiating a second laser beam onto said bottom of the first dividing groove to form a second dividing groove penetrating through the metal support and having a width smaller than a width of the first dividing groove.

2. The manufacturing method according to claim 1, wherein a cross-section of said second dividing groove has a pointed tip.

3. The manufacturing method according to claim 1, wherein an oscillation frequency of said second laser beam is higher than an oscillation frequency of said first laser beam.

4. The manufacturing method according to claim 1, wherein a scanning speed of said second laser beam is lower than a scanning speed of said first laser beam.

5. The manufacturing method according to claim 1, wherein a thickness of said metal support remaining below said first dividing groove before the step of radiating the second laser beam is less than or equal to about 40 μ

m.

12. The manufacturing method according to claim 1, wherein the thickness of said metal support remaining below said first dividing groove before the step of radiating the second laser beam is greater than or equal to about 50 μ

m.

6. A manufacturing method for semiconductor devices having a metal support, comprising:

growing a semiconductor film on a growth substrate;

forming a metal support on a surface of said semiconductor film opposite to the growth substrate;

thereafter removing said growth substrate from said semiconductor film;

forming a street groove reaching said metal support in the said semiconductor film;

radiating a first laser beam onto a surface of said metal support from a side opposite to a side on said semiconductor film is formed to form a first dividing groove having a substantially flat bottom in said metal support; and

radiating a second laser beam onto a surface of said metal support that has been exposed at a bottom of said street groove to form a second dividing groove reaching a bottom of the first dividing groove, thereby penetrating through said metal support.

7. The manufacturing method according to claim 6, wherein said first dividing groove has a rectangular or trapezoidal cross-section.

8. The manufacturing method according to claim 6, wherein a width of said second dividing groove is narrower than a width of said first dividing groove.

9. The manufacturing method according to claim 6, wherein an output power of said second laser beam is lower than an output power of said first laser beam.

10. The manufacturing method according to claim 6, wherein an oscillation frequency of said second laser beam is higher than an oscillation frequency of said first laser beam.

11. The manufacturing method according to claim 6, wherein a thickness of said metal support remaining below said first dividing groove before the step of radiating the second laser beam is greater than or equal to about 30 μ

m.

13. A manufacturing method for semiconductor devices having a metal support, comprising:

growing a semiconductor film on a growth substrate;

forming a metal support on a surface of said semiconductor film opposite to the growth substrate;

thereafter removing said growth substrate from said semiconductor film;

forming a street groove reaching said metal support in the said semiconductor film;

radiating a first laser beam onto said metal support to form a first dividing groove having a substantially flat bottom in said metal support; and

radiating a second laser beam onto said metal support to form a second dividing groove that penetrates through a portion of said metal support that remains where the first dividing groove is formed.

14. The manufacturing method according to claim 13, wherein a width of said second dividing groove is narrower than a width of said first dividing groove.

15. The manufacturing method according to claim 13, wherein an output power of said second laser beam is lower than an output power of said first laser beam.

16. The manufacturing method according to claim 13, wherein an oscillation frequency of said second laser beam is higher than an oscillation frequency of said first laser beam.