Semiconductor die package including multiple dies and a common node structure
First Claim
1. A semiconductor die package comprising:
- a substrate;
a first semiconductor die mounted on the substrate, wherein the first semiconductor die comprises a first input region and a first output region at opposite surfaces of the first semiconductor die;
a second semiconductor die mounted on the substrate, wherein second semiconductor die comprises a second input region and a second output region at opposite surfaces of the second semiconductor die;
a first clip electrically connected to the first output region in the first semiconductor die; and
a conductive node clip electrically communicating the first clip to the second input region in the second semiconductor die, wherein the first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.
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Accused Products
Abstract
A semiconductor die package capable of being mounted to a motherboard is disclosed. The semiconductor die package includes a substrate, and a first semiconductor die mounted on the substrate, where the first semiconductor die includes a first vertical device comprising a first input region and a first output region at opposite surfaces of the first semiconductor die. The semiconductor die package includes a second semiconductor die mounted on the substrate, where second semiconductor die comprises a second vertical device comprising a second input region and a second output region at opposite surfaces of the second semiconductor die. A substantially planar conductive node clip electrically communicates the first output region in the first semiconductor die and the second input region in the second semiconductor die. The first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip.
78 Citations
12 Claims
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1. A semiconductor die package comprising:
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a substrate; a first semiconductor die mounted on the substrate, wherein the first semiconductor die comprises a first input region and a first output region at opposite surfaces of the first semiconductor die; a second semiconductor die mounted on the substrate, wherein second semiconductor die comprises a second input region and a second output region at opposite surfaces of the second semiconductor die; a first clip electrically connected to the first output region in the first semiconductor die; and a conductive node clip electrically communicating the first clip to the second input region in the second semiconductor die, wherein the first semiconductor die and the second semiconductor die are between the substrate and the conductive node clip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor die package comprising:
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a substrate; a first semiconductor die mounted on the substrate, wherein the first semiconductor die comprises a first input region and a first output region at opposite surfaces of the first semiconductor die; a second semiconductor die mounted on the substrate, wherein second semiconductor die comprises a second input region and a second output region at opposite surfaces of the second semiconductor die; a first clip electrically connected to the first output region in the first semiconductor die; and a conductive node clip electrically communicating the first clip to the second input region in the second semiconductor die, wherein the first clip includes a plurality of stamped regions, wherein each stamped region in the plurality of stamped regions is in the form of a conductive cone.
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Specification