Thin disk laser operations with unique thermal management
First Claim
1. Thermal management apparatus for a thin disk laser system enabling the laser system to have isothermal temperatures across and throughout a thin disk, said apparatus comprising:
- a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K;
a thin disk lasing crystal or ceramic bonded to said mechanically controlled oscillating heat pipe; and
a supporting structure including a surface bonded to the thin disk lasing crystal or ceramic that matches the CTE (coefficient of thermal expansion) of both the thin disk lasing crystal or ceramic and the mechanically controlled oscillating heat pipe.
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Accused Products
Abstract
A thermal management apparatus and method for a thin disk laser system enabling the laser system to have near isothermal temperatures across and throughout a thin disk comprising a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K that promotes near isothermal conditions in lasing of the thin disk, a thin disk lasing crystal or ceramic bonded to the mechanically controlled oscillating heat pipe, and a supporting structure including a surface bonded to the thin disk that matches the CTE (coefficient of thermal expansion) of both materials.
31 Citations
16 Claims
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1. Thermal management apparatus for a thin disk laser system enabling the laser system to have isothermal temperatures across and throughout a thin disk, said apparatus comprising:
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a mechanically controlled oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K; a thin disk lasing crystal or ceramic bonded to said mechanically controlled oscillating heat pipe; and a supporting structure including a surface bonded to the thin disk lasing crystal or ceramic that matches the CTE (coefficient of thermal expansion) of both the thin disk lasing crystal or ceramic and the mechanically controlled oscillating heat pipe. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. Thermal management method for a thin disk laser system enabling the laser system to have isothermal temperatures across and throughout a thin disk, the method comprising the steps of:
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mechanically controlling an oscillating heat pipe having effective thermal conductivity of 10-20,000 W/m*K; bonding a thin disk lasing crystal or ceramic to the mechanically controlled oscillating heat pipe; and providing a supporting structure including a surface bonded to the thin disk lasing crystal or ceramic that matches the CTE (coefficient of thermal expansion) of both the thin disk lasing crystal or ceramic and the mechanically controlled oscillating heat pipe. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification