Methods and systems for detecting defects in a reticle design pattern
First Claim
1. A computer-implemented method for detecting defects in a reticle design pattern, comprising:
- acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern, wherein the images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process, wherein said acquiring comprises acquiring the images using two or more sensors disposed on the substrate and monochromatic light of the exposure system, wherein the two or more sensors are arranged at different heights on the substrate corresponding to different illumination focus conditions of the exposure system, and wherein the two or more sensors and the substrate are not tilted with respect to the image plane; and
detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.
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Abstract
Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.
414 Citations
21 Claims
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1. A computer-implemented method for detecting defects in a reticle design pattern, comprising:
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acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern, wherein the images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process, wherein said acquiring comprises acquiring the images using two or more sensors disposed on the substrate and monochromatic light of the exposure system, wherein the two or more sensors are arranged at different heights on the substrate corresponding to different illumination focus conditions of the exposure system, and wherein the two or more sensors and the substrate are not tilted with respect to the image plane; and detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A computer-implemented method for detecting defects in a design pattern, comprising:
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acquiring an image of the design pattern using a sensor disposed on a substrate arranged proximate to an image plane of a direct write exposure system configured to perform a wafer printing process using the design pattern, wherein the image illustrates how the design pattern will be projected on a wafer by the direct write exposure system in the wafer printing process, wherein said acquiring comprises acquiring images using two or more sensors disposed on the substrate and monochromatic light of the direct write exposure system, wherein the two or more sensors are arranged at different heights on the substrate corresponding to different illumination focus conditions of the direct write exposure system, and wherein the two or more sensors and the substrate are not tilted with respect to the image plane; and detecting defects in the design pattern based on a comparison between the image and a reference. - View Dependent Claims (14, 15, 16)
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17. A system configured to detect defects in a reticle design pattern, comprising:
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two or more sensors configured to acquire images of the reticle design pattern, wherein the two or more sensors are disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern and monochromatic light, wherein the two or more sensors are arranged at different heights on the substrate corresponding to different illumination focus conditions of the exposure system, wherein the two or more sensors and the substrate are not tilted with respect to the image plane, wherein the images are acquired using the monochromatic light, and wherein the images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process; and a processor coupled to the two or more sensors, wherein the processor is configured to detect defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values. - View Dependent Claims (18, 19, 20, 21)
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Specification