Electronic-integration compatible photonic integrated circuit and method for fabricating electronic-integration compatible photonic integrated circuit
First Claim
1. A method for integrating one or more photonic devices on a substrate with a semiconductor device, wherein the semiconductor device comprises one or more electronic devices, the method comprising:
- a. creating a first optical cladding layer on a first substrate;
b. creating a first optical core layer on top of the first optical cladding layer, wherein the first optical cladding layer and the first optical core layer form a first optical waveguide;
c. creating a first optical-fiber coupling lens on the first optical waveguide;
d. creating a first optical device, wherein an optical beam in the first waveguide propagates substantially in the first optical core layer;
e. optically connecting the first optical device to the first waveguide;
f. creating a first interspaced dielectric structure layer on top of the first optical core layer;
g. creating a second optical core layer on top of the first interspaced dielectric structure layer; and
h. creating a second optical device with optical beam propagating substantially in the second optical core layer;
i. mounting a first optical fiber on the first substrate to facilitate a coupling of light beam energy between the first optical fiber and the first optical waveguide.
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Abstract
An electronic-integration compatible photonic integrated circuit (EIC-PIC) for achieving high-performance computing and signal processing is provided. The electronic-integration compatible photonic integrated circuit comprises a plurality of electronic circuit structures and a plurality of photonic circuit structures. The electronic and photonic circuit structures are integrated by a process referred to as monolithic integration. An electronic circuit structure includes one or more electronic devices and a photonic circuit structure includes one or more photonic devices. The integration steps of electronic and photonic devices are further inserted into standard CMOS process. The photonic circuit structures and the electronic circuit structures are integrated to form the electronic-integration compatible photonic integrated circuit device.
114 Citations
22 Claims
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1. A method for integrating one or more photonic devices on a substrate with a semiconductor device, wherein the semiconductor device comprises one or more electronic devices, the method comprising:
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a. creating a first optical cladding layer on a first substrate; b. creating a first optical core layer on top of the first optical cladding layer, wherein the first optical cladding layer and the first optical core layer form a first optical waveguide; c. creating a first optical-fiber coupling lens on the first optical waveguide; d. creating a first optical device, wherein an optical beam in the first waveguide propagates substantially in the first optical core layer; e. optically connecting the first optical device to the first waveguide; f. creating a first interspaced dielectric structure layer on top of the first optical core layer; g. creating a second optical core layer on top of the first interspaced dielectric structure layer; and h. creating a second optical device with optical beam propagating substantially in the second optical core layer; i. mounting a first optical fiber on the first substrate to facilitate a coupling of light beam energy between the first optical fiber and the first optical waveguide. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification