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Lead implant system

  • US 8,214,045 B2
  • Filed: 04/30/2008
  • Issued: 07/03/2012
  • Est. Priority Date: 04/30/2008
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a lead coupling device having a first wireless communication module, wherein the lead coupling device is adapted to receive a medical lead;

    an interface device having a second wireless communication module configured for remote communication with the first wireless module;

    a hermetically sealed medical device package;

    an implantable medical device including a connector bore and an electrical contact contained within the hermetically sealed medical device package;

    an electrical interface configured for coupling the electrical contact of the implantable medical device with the interface device, wherein the interface device is located outside the package; and

    an implantable medical device programmer, wherein the programmer is configured for communication with the implantable medical device;

    wherein the lead coupling device includes;

    a housing having a proximal opening at a proximal end and a distal opening at a distal end;

    a lead receiving channel disposed within the housing and extending from the proximal opening to the distal opening, wherein said channel is adapted to receive the medical lead;

    a pulse generator disposed within the housing for providing electrical energy;

    a processor coupled to the pulse generator;

    at least two electrical contacts mounted within the channel and coupled to the pulse generator, wherein a portion of the contacts is adapted to contact the lead; and

    a power source disposed within the housing and coupled to the pulse generator.

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