Pressure sensor for harsh media sensing and flexible packaging

• US 8,215,176 B2
• Filed: 05/27/2009
• Issued: 07/10/2012
• Est. Priority Date: 05/27/2009
• Status: Active Grant

• Current Assignee: Vitesco Technologies USA, LLC (Continental AG)
• Original Assignee: Continental Automotive Systems, Inc. (Continental AG)
• Inventors: Ding, Xiaoyi, Frye, Jeffrey J., Chiou, Jen-Huang Albert
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): Jenkins, Jermaine
• Application Number:
  US12/473,176
• Publication Number:
  US 20100300207A1
• Time in Patent Office: 1,140 Days
• Field of Search: None
• US Class Current: 73/721
• CPC Class Codes: G01L 19/0069 from the sensor to its support
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Abstract

MEMS pressure sensing elements, the fabrication methods of the sensing elements, and the packaging methods using the new sensing elements are introduced to provide a way for a harsh media absolute pressure sensing and eliminating the negative effects caused by the gel used in the prior art. The invention uses vertical conductive vias to electrically connect the enclosed circuit to the outside, and uses a fusion bond method to attach a cap with the embedded conductive vias over a device die having a circuit for example a piezoresistive Wheatstone bridge to sense pressure. New packaging methods comprise a) a two-pocket housing structure and using a surface mounting method to attach a new sensing element into one pocket by a ball grid array (BGA), and b) a single pocket structure and using conventional die attach and wire bonding. Both methods can be used for harsh media pressure sensing but without the negative effects caused by the gel in prior art.

Claims

1. A pressure sensor element, comprising:

a silicon cap having first and second sides, the first side including a recess extending into the cap, and the cap further having at least one insulated conductive via residing outside of the recess;

a silicon die having first and second sides, the first side including a circuit, electrical interconnects, and a silicon diaphragm, the second side having a cavity extending into the die with the bottom surface being the bottom surface of the silicon diaphragm; and

a bonding layer attaching the first side of the silicon die to the first side of the silicon cap;

wherein the recess of the cap encapsulating the top surface of the diaphragm on the die, and the at least one conductive via in the cap electrically connecting with at least one of the electrical interconnects.

2. The pressure sensor element of claim 1, wherein the bonding layer between the first side of the cap and the first side of the silicon die is silicon oxide.

3. The pressure sensor element of claim 1, wherein the at least one conductive via has a first end and second end and the conductive via is comprised of at least one of:

metal; and

doped poly crystalline silicon.

4. The pressure sensor element of claim 1, wherein the second side of the cap includes a dielectric layer and at least one metal bond pad on top of the dielectric layer connecting to the at least one conductive via by a metal interconnect through a contact window in the dielectric layer.

5. The pressure sensor element of claim 1, wherein the at least one conductive via is within a cylindrically-shaped silicon island and the silicon island is isolated from the rest of the silicon cap by an annulus shaped dielectric material surrounding the cylindrically-shaped silicon island.

6. The pressure sensor element of claim 1, wherein the recess is at least partially evacuated.

7. The pressure sensor element of claim 1, wherein the recess has a through cap hole.

8. The pressure sensor element of claim 1, further comprising a passivation layer over at least a portion of the first side of the silicon die including the silicon diaphragm.

9. The pressure sensor element of claim 1, further comprising a pedestal having top and bottom surfaces and a through hole between the top and bottom surfaces.

10. The pressure sensor element of claim 9, wherein the pedestal is silicon.

11. The pressure sensor element of claim 10, further comprising a fusion bond between the second side of the silicon die and the top surface of the pedestal, and the hole of the pedestal at least partially overlapping with the cavity of the silicon die.

12. The pressure sensor element of claim 10, further comprising an adhesive bond between the second side of the silicon die and the top surface of the pedestal and the hole of the pedestal substrate at least partially overlapping with the cavity of the silicon die.

13. The pressure sensor element of claim 9, wherein the pedestal is borosilicate glass.

14. The pressure sensor element of claim 13, further comprising an anodic bond between the second side of the silicon die and the top surface of the pedestal, and the hole of the pedestal at least partially overlaps the cavity of the silicon die.

15. The pressure sensor element of claim 1, wherein the recess on the silicon cap has a depth greater than the deflection of the diaphragm.

16. The pressure sensor element of claim 13, further comprising an adhesive bond between the second side of the silicon die and the top surface of the pedestal, and the hole of the pedestal substrate at least partially overlapping with the cavity of the silicon die.

17. A pressure sensor comprised of:

a cover with a port;

a housing including first and second pockets, and at least one lead frame extending between the first and second pockets;

a pressure sensor element in the second pocket;

a metallic connector electrically connecting at least one lead frame with one metal bond pad of the pressure sensor element;

at least one integrated circuit (IC) in the first pocket, electrically connected to the pressure sensing element via wires, lead frame and metallic connector; and

a gel partially filling the first pocket to cover the circuit and wire bonds.

18. The pressure sensor of claim 17, the pressure sensor element further comprising:

a silicon cap having first and second sides, the first side including a recess extending into the cap, and the cap further having at least one insulated conductive via residing outside of the recess;

a silicon die having first and second sides, the first side including a circuit, electrical interconnects, and a silicon diaphragm, the second side having a cavity extending into the die with the bottom surface being the bottom surface of the silicon diaphragm; and

a bonding layer attaching the first side of the silicon die to the first side of the silicon cap;

wherein the recess of the cap encapsulating the top surface of the diaphragm on the die, and the at least one conductive via in the cap electrically connecting with at least one of the electrical interconnects.

19. The pressure sensor of claim 17, wherein the metallic connector is an adhesive.

20. The pressure sensor of claim 17, wherein an under-fill material covers the metallic connector.

21. A pressure sensor comprised of:

a cover;

a housing with a port and lead frame, and the housing having top and bottom sides;

a pressure sensor element mounted in the housing using adhesive material;

at least one integrated circuit (IC), electrically connected to the pressure sensing element via wires;

a gel partially filling the housing to cover IC, pressure sensor element and wires; and

the sensor element including;

a silicon cap having first and second sides, the first side including a recess extending into the cap, and the cap further having at least one insulated conductive via residing outside of the recess;

a silicon die having first and second sides, the first side including a circuit, electrical interconnects, and a silicon diaphragm, the second side having a cavity extending into the die with the bottom surface being the bottom surface of the silicon diaphragm;

a bonding layer attaching the first side of the silicon die to the first side of the silicon cap;

the recess of the cap encapsulating the top surface of the diaphragm on the die, and the at least one conductive via in the cap electrically connecting with at least one of the electrical interconnects.

22. The pressure sensor of claim 21, wherein the port is located at the bottom side of the housing.

23. The pressure sensor of claim 22, wherein the port is at least partially overlapped with the cavity of the pressure sensor element.