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Sensor device to monitor deformation in structural members, such as solid structures

  • US 8,215,178 B2
  • Filed: 05/02/2008
  • Issued: 07/10/2012
  • Est. Priority Date: 05/02/2007
  • Status: Active Grant
First Claim
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1. A sensor device comprising:

  • a sensing component adapted to be connected to a monitoring system to send signals associated with deformation of a structural member, the sensor component being at least one strain gage adapted to be bonded to a surface of the structural member;

    a double-sided tape having a first adhesive surface adapted to be adhered to the surface of the structural member to be monitored, with the at least one strain gage being positioned between the tape and the surface of the structural member, and a second adhesive surface adapted to adherently support components associated with the sensing component; and

    a backing sheet temporarily connected to the first adhesive surface to protect the first adhesive surface and the at least one strain gage, the at least one strain gauge being between the backing sheet and the first adhesive surface whereby the at least one strain gauge is exposed when the backing sheet is removed from the first adhesive surface.

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