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USB device with heat dissipating thermal link

  • US 8,215,981 B2
  • Filed: 04/23/2010
  • Issued: 07/10/2012
  • Est. Priority Date: 12/04/2009
  • Status: Active Grant
First Claim
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1. A USB device, comprising:

  • a housing;

    a circuit board, disposed in the housing;

    a chip, disposed on the circuit board;

    a USB connector, connected to the circuit board;

    a metal connector, connected to the USB connector, wherein the metal connector comprises an extended portion, a gap is formed between the extended portion and the chip, and the extended portion corresponds to the chip to dissipate heat from the chip; and

    a heat transfer pad, wherein the heat transfer pad is sandwiched between the chip and the extended portion;

    wherein the housing comprises a body and a cover, the body is connected to the cover, and the circuit board is sandwiched between the body and the cover, andwherein a positioning hole is formed on the extended portion, a positioning post is formed on the cover, and the positioning post passes through the positioning hole.

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