Implantable optical sensor and method for manufacture

• US 8,216,134 B2
• Filed: 05/07/2008
• Issued: 07/10/2012
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Ries, Andrew J., York, Jeffrey O., Belcher, Stephen R., Jelen, Jeffrey M.
• Primary Examiner(s): Yao, Sam
• Assistant Examiner(s): Archer, Marie
• Application Number:
  US12/116,705
• Publication Number:
  US 20090156905A1
• Time in Patent Office: 1,525 Days
• Field of Search: 600300-301, 600/339, 600/333, 600322-325, 600/341, 600/328, 600/344, 600/372, 600/472, 600/476, 607/22, 607/122
• US Class Current: 600/300
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/0084 for introduction into the body, e.g. by catheters A61B5/1459 takes precedence
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14542 for measuring blood gases A61B5/14551 takes precedence
• CPC Class Codes: A61B 5/1459 invasive, e.g. introduced into the body by a catheter A61B5/1464 takes precedence

Abstract

An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.

Claims

1. An manufacturing assembly, comprising:

a plurality of modular sensor assemblies, each of the plurality of modular sensor assemblies comprising;

a circuit board; and

a plurality of electronic components mounted on a top surface of the circuit board, multiple ones of the plurality of electronic components being mounted in a location on the circuit board corresponding to a location for each of the plurality of modular sensor assemblies;

a framework, comprising;

a supporting structure; and

a wall for each of the modular sensor assemblies, the walls being supported by the supporting structure and having an outer surface and an inner surface separated by a top edge and a bottom edge, the bottom edge configured to be positioned against the circuit board;

wherein the wall comprises a first flange extending from the wall proximate the bottom edge; and

a coating applied to the circuit board top surface along the wall for coupling the wall to the circuit board and providing additional isolation against light for the electronic component, the first flange embedded in the coating for retaining the wall bottom edge against the circuit board;

wherein each of the plurality of modular sensor assemblies is isolated from an emission of an electronic component of another one of the plurality of modular sensor assemblies.

2. The manufacturing assembly of claim 1 further comprising:

a window formed in a housing; and

a ferrule mounted in the window, said ferrule comprising a groove for receiving the top wall edge and providing additional isolation against light for the electronic component.

3. The manufacturing assembly of claim 2 wherein the ferrule groove and wall outer surface form an interference fit for retaining the top wall edge within the groove.

4. The manufacturing assembly of claim 2 wherein the modular sensor assembly further comprises a stop surface for interfacing with the ferrule.

5. The manufacturing assembly of claim 4 wherein the wall further comprises a second flange, the stop surface formed on the second flange and not embedded in the coating.

6. The manufacturing assembly of claim 4 wherein the stop surface is formed at a height from the wall bottom edge for controlling a distance between the window and the electronic component.

7. The manufacturing assembly of claim 5 wherein one of the first flange and the second flange extends from the wall outer surface.

8. The manufacturing assembly of claim 2 wherein the electronic component is an opto-electronic component and the wall is formed from a light-insulating material.

9. The manufacturing assembly of claim 8 further comprising a lens mounted in the ferrule over the opto-electronic device.

10. The manufacturing assembly of claim 9 further comprising an optical coating applied along the lens and ferrule.

23. The manufacturing assembly of claim 1 wherein the coating has a thickness such that the coating interfaces with the outer surface of the wall.

24. The manufacturing assembly of claim 23 wherein the flange has a height relative to said bottom edge and wherein the thickness of the coating is at least as great as the height of the flange.

11. A method for manufacturing a plurality of modular sensor assemblies, comprising the steps of:

molding a framework comprising a wall for each of the modular sensor assemblies, the walls supported by a supporting structure and having an outer surface and an inner surface separated by a top edge and a bottom edge;

mounting a plurality of electronic components on a top surface of a circuit board, multiple ones of the plurality of electronic components being mounted in a location on the circuit board corresponding to a location for each of the plurality of modular sensor assemblies;

then

coupling the framework to the top surface of the circuit board, the bottom edge of the wall being positioned against the circuit board, wherein each wall of each one of the plurality of modular sensor assemblies encircles corresponding multiple ones of the plurality of electronic components of each corresponding one of the plurality of modular sensor assemblies to provide isolation against at least one of light, heat and fluid for electronic components of each modular sensor assembly; and

then

applying a coating to the circuit board top surface along the wall for coupling the wall to the circuit board and providing additional isolation against light for the electronic component, wherein the wall comprises a first flange extending from the wall proximate the bottom edge, the first flange being embedded in the coating for retaining the wall bottom edge against the circuit board; and

then

cutting the plurality of modular sensor assemblies out of the circuit board.

12. The method of claim 11 further comprising

forming a window in the housing;

mounting a ferrule in the window, the ferrule comprising a groove for receiving the top wall edge and providing additional isolation against light for the electronic component; and

coupling the modular sensor assembly to the hermetically sealed housing by inserting the top wall edge into the ferrule groove.

13. The method of claim 12 wherein the ferrule groove and wall outer surface form an interference fit for retaining the top wall edge within the groove.

14. The method of claim 12 wherein molding the framework further comprises forming a stop surface for interfacing with the ferrule.

15. The method of claim 14 wherein the wall further comprises a second flange, the stop surface formed on the second flange and not embedded in the coating.

16. The method of claim 14 wherein the stop surface is formed at a height from the wall bottom edge for controlling a distance between the window and the electronic component.

17. The method of claim 15 wherein one of the first flange and the second flange extends from the wall outer surface.

18. The method of claim 12 wherein the electronic component is an opto-electronic component and the wall is formed from a light-insulating material.

19. The method of claim 18 further comprising mounting a lens in the ferrule.

20. The method of claim 18 further comprising applying an optical coating along the lens and ferrule.

21. The method of claim 11 wherein molding the framework comprises forming the supporting structure by mounting pegs along a frame and wherein coupling the framework on the circuit board top surface comprises aligning the mounting pegs with holes formed in the circuit board top surface.

22. The method of claim 21 wherein applying the coating comprises filling a portion of the framework with a coating material.

25. The method of claim 11 wherein the applying the coating step applies the coating to a thickness such that the coating interfaces with the outer surface of the wall.

26. The method of claim 25 wherein the flange has a height relative to said bottom edge and wherein the applying the coating step applies the coating with the thickness of the coating being at least as great as the height of the flange.