Spinal implant kits with multiple interchangeable modules

• US 8,216,279 B2
• Filed: 02/18/2010
• Issued: 07/10/2012
• Est. Priority Date: 01/27/2006
• Status: Active Grant

• Current Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Original Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Inventors: Bruneau, Aurelien, Lange, Eric C., Anderson, Kent M.
• Primary Examiner(s): Hammond, Ellen C
• Application Number:
  US12/708,416
• Publication Number:
  US 20100145387A1
• Time in Patent Office: 873 Days
• Field of Search: 600/594, 623 1711- 1716, 606/90, 606/248, 606/249, 606/279
• US Class Current: 606/249
• CPC Class Codes: A61B 17/7062 Devices acting on, attached to, or simulating the effect of, vertebral processes, vertebral facets or ribs rib fixation devices A61B17/8076; Tools for such devices
• CPC Class Codes: A61B 2090/064 for measuring force, pressure or mechanical tension

Abstract

An interspinous implant kit includes a receiver body and multiple modules. The receiver body is adapted to be implanted between a spinous processes and includes corresponding saddles with an intermediate section therebetween. The intermediate section includes a module-receiving bay. The modules are configured to be interchangeably received in the bay. The first module may have a sensor adapted to generate measurement data indicative of at least one of forces acting on said receiver body and strain when mated to said receiver body. The second and third modules have mechanical material properties that are the of the same type, but different. One of the modules is advantageously mated to the receiver body to form a long-term implant.

Claims

1. An interspinous implant kit, comprising:

a receiver body adapted to be implanted between a superior spinous process and an inferior spinous process;

said receiver body comprising a superior saddle adapted to accept the superior spinous process, an inferior saddle adapted to accept the inferior spinous process, and an intermediate section therebetween;

said intermediate section comprising a module-receiving bay;

first, second, and third modules configured to be interchangeably received in said module-receiving bay;

said first module having a sensor disposed therein;

said sensor adapted to generate measurement data indicative of at least one of forces acting on said receiver body and strain when mated to said receiver body;

the first module having a first mechanical material property;

said second module having a second mechanical material property; and

said third module having a third mechanical material property of the same type, but different than, said second mechanical material property.

2. The interspinous implant kit of claim 1 wherein the sensor is adapted to generate measurement data indicative of strain when mated to said receiver body.

3. The interspinous implant kit of claim 2 wherein the sensor is adapted to generate measurement data indicative of vertical strain between the saddles when mated to said receiver body.

4. The interspinous implant kit of claim 1 wherein the superior and inferior saddles are symmetric.

5. The interspinous implant kit of claim 1 wherein the sensor is adapted to generate measurement data indicative of a load acting on the receiver body when mated to said receiver body.

6. The interspinous implant kit of claim 5 wherein the sensor is adapted to generate measurement data indicative of load acting on the receiver body at a moment in time when mated to said receiver body.

7. The interspinous implant kit of claim 1 wherein the sensor is adapted to generate measurement data indicative of pressure acting on the receiver body when mated to said receiver body.

8. The interspinous implant kit of claim 1 wherein the first module further comprises a transmitter for transmitting sensor data from the first module.

9. The interspinous implant kit of claim 1 wherein the mechanical material property is an elastic modulus.

10. The interspinous implant kit of claim 1 wherein the mechanical material property is a flexural modulus.

11. The interspinous implant kit of claim 1 wherein the mechanical material property is a dampening property.