Structured resin systems with high thermal conductivity fillers
First Claim
Patent Images
1. A continuous organic-inorganic highly structured resin comprising:
- a host highly structured resin network comprising a plurality of mesogenic groups; and
inorganic high thermal conductivity fillers being evenly dispersed in said host highly structured resin network, wherein said inorganic high thermal conductivity fillers comprise surface functional groups that covalently bond said high thermal conductivity fillers directly to said host highly structured resin network;
wherein said high thermal conductivity fillers have a length of between 1-1000 nm and an aspect ratio of 10-50;
wherein said plurality of mesogenic groups and said thermal conductivity fillers are in substantial alignment with one another in a uniform direction; and
wherein the continuous organic-inorganic highly structured resin comprises minimal to no interfacial gaps or microvoids formed therein and is effective to reduce an amount of phonon scattering and to increase an amount of phonon transport in the resin.
3 Assignments
0 Petitions
Accused Products
Abstract
In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.
109 Citations
10 Claims
-
1. A continuous organic-inorganic highly structured resin comprising:
-
a host highly structured resin network comprising a plurality of mesogenic groups; and inorganic high thermal conductivity fillers being evenly dispersed in said host highly structured resin network, wherein said inorganic high thermal conductivity fillers comprise surface functional groups that covalently bond said high thermal conductivity fillers directly to said host highly structured resin network; wherein said high thermal conductivity fillers have a length of between 1-1000 nm and an aspect ratio of 10-50; wherein said plurality of mesogenic groups and said thermal conductivity fillers are in substantial alignment with one another in a uniform direction; and wherein the continuous organic-inorganic highly structured resin comprises minimal to no interfacial gaps or microvoids formed therein and is effective to reduce an amount of phonon scattering and to increase an amount of phonon transport in the resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification