Production methods of electronic devices
First Claim
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1. A method of production of an electronic device having mounted thereon a microelectromechanical system element, which comprises the steps of:
- forming a micromachine component and electronic component for operation of said micromachine component on a substrate to form said system element;
forming a lid provided with conductor-filled vias formed passing through the lid in a thickness direction thereof, and wiring patterns connected with an end surface of the vias;
bonding to said substrate said lid covering an active surface of said substrate to define an operating space for said micromachine component and electrically connecting, via bumps, electrodes of said substrate and the wiring patterns of said lid at a bonded part of said substrate and said lid; and
forming, at said substrate, said lid, a continuous ultrasonic bonded part in contact with at an outer periphery of said operating space side of said substrate and said lid without interruption.
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Abstract
A method of producing an electronic device having mounted thereon a microelectromechanical system element. The method includes forming a micromachine component and electronic component for operation of the micromachine component on a substrate to form the system element, and bonding to the substrate a lid covering an active surface of the substrate and provided with wiring patterns to define an operating space for the micromachine component and electrically connecting the electronic component and the wiring patterns of the lid at a bonded part of the substrate and the lid.
75 Citations
12 Claims
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1. A method of production of an electronic device having mounted thereon a microelectromechanical system element, which comprises the steps of:
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forming a micromachine component and electronic component for operation of said micromachine component on a substrate to form said system element; forming a lid provided with conductor-filled vias formed passing through the lid in a thickness direction thereof, and wiring patterns connected with an end surface of the vias; bonding to said substrate said lid covering an active surface of said substrate to define an operating space for said micromachine component and electrically connecting, via bumps, electrodes of said substrate and the wiring patterns of said lid at a bonded part of said substrate and said lid; and forming, at said substrate, said lid, a continuous ultrasonic bonded part in contact with at an outer periphery of said operating space side of said substrate and said lid without interruption. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of production of an electronic device having mounted thereon a microelectromechanical system element, which comprises the steps of:
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forming a micromachine component and electronic component for operation of said micromachine component on a substrate to form said system element; forming a lid provided with conductor-filled vias formed passing through the lid in a thickness direction thereof, and wiring patterns connected with an end surface of the vias; bonding to said substrate said lid covering an active surface of said substrate to define an operating space for said micromachine component and electrically connecting, via bumps, electrodes of said substrate and the wiring patterns of said lid at a bonded part of said substrate and said lid; batch-wise producing a plurality of said electronic devices at the same time by a wafer level package process, then cutting out the individual electronic devices; and forming, at said substrate, said lid, a continuous ultrasonic bonded part in contact with at an outer periphery of said operating space side of said substrate and said lid without interruption. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification