Solid state lighting component

• US 8,217,412 B2
• Filed: 09/16/2010
• Issued: 07/10/2012
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Yuan, Thomas, Keller, Bernd, Ibbetson, James, Tarsa, Eric, Negley, Gerald
• Primary Examiner(s): DANG, PHUC T
• Application Number:
  US12/883,979
• Publication Number:
  US 20110012143A1
• Time in Patent Office: 663 Days
• Field of Search: 257/89, 257/91, 257/98, 362/235, 362/249, 362/252
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Claims

1. A white emitting light emitting diode (LED) package comprising an LED chip array and an overmolded lens over said array having a diameter greater than 5 millimeters, wherein said lens has a diameter being approximately the same as or larger than the width of said array.

2. The LED package of claim 1, wherein said lens has a diameter of approximately 11 millimeters.

3. The LED package of claim 1, wherein said LED chip array comprises 26 LED chips, each of which emits light at one of a plurality of colors.

4. The LED package of claim 1, wherein said lens comprises a hemispheric lens having a diameter of approximately 11 millimeters.

5. The LED package of claim 1, wherein the focal point of said lens is located in or below the horizontal plane created by the emitting region of the LED chips.

6. The LED package of claim 1, wherein said lens comprises an aggregate of multiple optical elements.

7. The LED package of claim 1, wherein said lens comprises an essentially flat optically transparent element.