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Remote plasma processing of interface surfaces

  • US 8,217,513 B2
  • Filed: 02/02/2011
  • Issued: 07/10/2012
  • Est. Priority Date: 06/12/2009
  • Status: Expired due to Fees
First Claim
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1. A semiconductor processing apparatus, comprising:

  • a processing chamber;

    a load lock coupled to the processing chamber via a transfer port;

    a wafer pedestal disposed in the load lock and configured to support a wafer in the load lock;

    a remote plasma source configured to provide a remote plasma to the load lock; and

    an ion filter configured to filter ions from a flow of the remote plasma.

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