Systems and methods to test integrated circuits

• US 8,217,674 B2
• Filed: 02/08/2010
• Issued: 07/10/2012
• Est. Priority Date: 02/08/2010
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Amaro, Michael G., Luo, Yuwei, Bonfitto, John M., Kane, Michael J.
• Primary Examiner(s): Koval, Melissa
• Assistant Examiner(s): NGUYEN, TRUNG Q
• Application Number:
  US12/702,048
• Publication Number:
  US 20110193581A1
• Time in Patent Office: 883 Days
• Field of Search: None
• US Class Current: 324/756.01
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

Open and short systems and methods for testing integrated circuits are disclosed. An example implementation includes engaging an integrated circuit testing module with an integrated circuit testing apparatus, the integrated circuit testing module for receiving an integrated circuit, a first set of contact points, and a second set of contact points; engaging a first probe onto at least one of the contact points of the first set of contact points, controllably engaging at least one of a second probe onto at least one contact pair of the integrated circuit testing module, and providing an electrical stimulus to the integrated circuit testing module.

Claims

1. A method for open and short testing an integrated circuit, the method comprising:

engaging an integrated circuit testing module with an integrated circuit testing apparatus, the integrated circuit testing module having an integrated circuit to be tested, a first set of contact points, and a second set of contact points, wherein the first set of contact points are electrically coupled to the pins of the integrated circuit, and wherein contact points of the second set are aligned in contact pairs, the contact pairs being aligned to allow a first pin of the integrated circuit to be at least one of disconnected from any signal on the integrated circuit testing module or electrically shorted to at least one of a second pin of the integrated circuit, a ground connection, or a power connection;

engaging a first probe of the integrated circuit testing apparatus onto at least one of the contact points of the first set of contact points;

controllably engaging at least one of a second probe of the integrated circuit testing apparatus onto at least one contact pair of the integrated circuit testing module, thereby creating an electrical short between the at least two contact points of the second set; and

providing an electrical stimulus to the integrated circuit testing module.

2. The method as described in claim 1, further comprising:

determining if the response of the integrated circuit is within an acceptable range of outputs given the input stimulus and the configuration of the at least one of the second probe.

3. The method as described in claim 2, further comprising:

disengaging the integrated circuit testing module from the integrated circuit testing apparatus, and reengaging a second integrated circuit testing module when it is determined that the response of the integrated circuit is not within an acceptable range of outputs.

4. The method as described in claim 1, wherein the integrated circuit testing module further includes a third set of contact points and the integrated circuit testing apparatus further includes a cable to engage the third set of contact points of the integrated circuit testing module.

5. The method as described in claim 4, wherein the cable is a ribbon cable.

6. The method as described in claim 4, wherein the electrical stimulus is provided to the integrated circuit testing module via the cable.

7. The method as described in claim 1, wherein engaging the integrated circuit with the integrated circuit testing module comprises permanently attaching the integrated circuit to the integrated circuit testing module.

8. The method as described in claim 1, wherein engaging the integrated circuit with the integrated circuit testing module comprises electrically coupling the pins of the integrated circuit to the first set of contact points.

9. The method as described in claim 1, wherein the first pin of the integrated circuit and the second pin of the integrated circuit are adjacent.

10. The method as described in claim 1, further comprising:

measuring a response of the integrated circuit via the first probe.

11. A system for open and short testing of an integrated circuit, the apparatus comprising:

an integrated circuit testing module to engage an integrated circuit, the integrated circuit testing module having a first set of contact points electrically coupled to the pins of the integrated circuit, and a second set of contact points;

an integrated circuit testing apparatus to engage the integrated circuit testing module, the integrated circuit testing apparatus having at least one of a first probe and at least one of a second probe;

the first set of contact points to allow the first probe to be electrically connected to the pins of the integrated circuit; and

the second set of contact points to allow the second probe to at least one of electrically short or electrically open at least one of the pins of the integrated circuit.

12. The system as described in claim 11, wherein the first probe has an electrically conductive tip.

13. The system as described in claim 11, wherein the first probe is a fixed-location, spring-based probe.

14. The system as described in claim 11, wherein the second probe has an electrically conductive malleable tip.

15. The system as described in claim 11, wherein the second probe is pneumatically actuated.

16. The system as described in claim 11, wherein the second set of contact points are aligned in contact pairs.

17. The system as described in claim 16, wherein the contact pairs form a square separated by a saw tooth shaped gap.

18. A method for open and short testing of an integrated circuit, the method comprising:

engaging an integrated circuit testing module with an integrated circuit testing apparatus, the integrated circuit testing module having an integrated circuit to be tested, a first set of contact points, a second set of contact points, and a third set of contact points, wherein the first set of contact points are electrically coupled to the pins of the integrated circuit, and wherein contact points of the second set are aligned in contact pairs, the contact pairs being aligned to allow a first pin of the integrated circuit to be at least one of disconnected from any signal on the integrated circuit testing module or electrically shorted to at least one of a second pin of the integrated circuit, a ground connection, or a power connection;

engaging a first probe of the integrated circuit testing apparatus onto at least one of the contact points of the first set of contact points;

controllably engaging at least one of a second probe of the integrated circuit testing apparatus onto at least one contact pair of the integrated circuit testing module, thereby creating an electrical short between the at least two contact points of the second set;

engaging a cable of the integrated circuit testing apparatus on to the third set of contact points;

providing an electrical stimulus to the integrated circuit testing module via at least one of the cable or the first probe;

measuring a response of the integrated circuit via the first probe;

determining if the response of the integrated circuit is within an acceptable range of outputs given the input stimulus and the configuration of the at least one of the second probe; and

disengaging the integrated circuit testing module from the integrated circuit testing apparatus when it is determined that the response of the integrated circuit is not within an acceptable range of outputs, and engaging a second integrated circuit testing module.

19. The method as described in claim 18, wherein at least one of the second probe has an electrically conductive malleable tip.

20. The method as described in claim 18, wherein engaging and disengaging the integrated circuit testing module into and out of the integrated circuit testing apparatus comprises robotically moving at least one of the integrated circuit testing module or the integrated circuit testing apparatus.