Component comprising a MEMS microphone and method for the production of said component

• US 8,218,794 B2
• Filed: 03/23/2009
• Issued: 07/10/2012
• Est. Priority Date: 09/29/2006
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Pahl, Wolfgang
• Primary Examiner(s): Ensey, Brian
• Application Number:
  US12/409,328
• Publication Number:
  US 20090232336A1
• Time in Patent Office: 1,205 Days
• Field of Search: 381/175, 381/355, 381/369, 257/704, 257/729, 257/730
• US Class Current: 381/175
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/10155 being other than a cuboid
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/2892 Mountings or supports for transducers
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

A component with a housing for a MEMS microphone is proposed that has a cavity with terminals arranged in the cavity, a sound inlet opening, and SMT contacts on an outer side. The MEMS chip installed in this housing closes the sound inlet opening from the inside and is connected by means of electrically conductive connections to the terminals of the housing. Opposite the electrically conductive connections, the MEMS chip is in mechanically intimate contact with the housing. The dimensioning of the housing relative to the MEMS chip allows the cavity at the sides of the MEMS chip to be used as an acoustic rear volume.

Claims

1. A component with MEMS microphone, the component comprising:

a housing that has a cavity;

terminals arranged in the cavity;

a sound inlet opening;

SMT contacts on an outer side of the housing; and

a MEMS chip with microphone function that is installed in the cavity of the housing and closing the sound inlet opening from the inside, the MEMS chip being connected by means of an electrically conductive connection to the terminals arranged in the cavity of the housing and being connected through the housing to the SMT contacts, the MEMS chip being in mechanically intimate contact with the housing with its surface lying opposite the electrically conductive connections,

wherein a back side volume for the microphone function of the MEMS chip is expanded from the cavity in the housing to sides of the MEMS chip, and wherein the sound inlet opening is closed tightly by a surface of the MEMS chip, but on an opposite surface of the MEMS chip, between the housing and MEMS chip there is a connection suitable for quick pressure equalization between this surface and the cavity in the housing at sides of the MEMS chip.

2. The component according to claim 1, wherein the mechanically intimate contact is realized by means of an elastic compound that is arranged between the MEMS chip and the housing.

3. The component according to claim 1, wherein the SMT contacts are arranged on the bottom side of the housing and wherein the MEMS chip is mounted on a housing floor by means of a flip-chip-like connection.

4. The component according to claim 1, wherein the MEMS chip is mounted on a housing floor with an electrically conductive adhesive.

5. The component according to claim 1, wherein the MEMS chip is mounted on a housing floor directly or indirectly by means of a solder point.

6. The component according to claim 1, wherein the SMT contacts are arranged on a bottom side of the housing and wherein the sound inlet opening points upward.

7. The component according to claim 1, wherein the housing comprises a metallic material or has a metallic coating.

8. The component according to claim 1, wherein the housing includes a bottom part and a cover, wherein, in the bottom part, there is a recess defining the cavity.

9. The component according to claim 8, wherein the cover includes a structured metal foil or a structured, metal-coated plastic foil with a sound inlet opening.

10. The component according to claim 8, wherein the cover is bonded, soldered, or welded on the bottom part.

11. The component according to claim 1, wherein the sound inlet opening includes a region with a plurality of smaller openings arranged in this region.

12. A component with MEMS microphone, the component comprising:

a housing that has a cavity;

terminals arranged in the cavity;

a sound inlet opening;

SMT contacts on an outer side of the housing; and

a MEMS chip with microphone function that is installed in the cavity of the housing and closing the sound inlet opening from the inside, the MEMS chip being connected by means of an electrically conductive connection to the terminals arranged in the cavity of the housing and being connected through the housing to the SMT contacts, the MEMS chip being in mechanically intimate contact with the housing with its surface lying opposite the electrically conductive connections,

wherein a back side volume for the microphone function of the MEMS chip is expanded from the cavity in the housing to sides of the MEMS chip, and wherein the electrically conductive connections comprise spring elements.

13. A component with MEMS microphone, the component comprising:

a housing that has a cavity;

terminals arranged in the cavity;

a sound inlet opening;

SMT contacts on an outer side of the housing; and

a MEMS chip with microphone function that is installed in the cavity of the housing and closing the sound inlet opening from the inside, the MEMS chip being connected by means of an electrically conductive connection to the terminals arranged in the cavity of the housing and being connected through the housing to the SMT contacts, the MEMS chip being in mechanically intimate contact with the housing with its surface lying opposite the electrically conductive connections, wherein a back side volume for the microphone function of the MEMS chip is expanded from the cavity in the housing to sides of the MEMS chip, wherein a housing floor includes a circuit board, and wherein the circuit board has vias that connect the terminals to the SMT contacts.