Battery-operated wireless-communication apparatus and method

• US 8,219,140 B2
• Filed: 01/25/2011
• Issued: 07/10/2012
• Est. Priority Date: 03/24/2000
• Status: Expired due to Fees

• Current Assignee: Cymbet Corporation
• Original Assignee: Cymbet Corporation
• Inventors: Jacobs, Harlan T., Jenson, Mark L., Yan, Jenn-Feng, Klassen, Jody J.
• Primary Examiner(s): Jackson, Blane J
• Application Number:
  US13/013,804
• Publication Number:
  US 20110300413A1
• Time in Patent Office: 532 Days
• Field of Search: 429/122, 429/124, 429/149, 429/153, 429/162, 429/163, 429/188, 429/304, 429/322, 429/209, 429/247, 257/678, 257/690, 257/701, 257/707, 257/734, 257735-738, 257/773, 257/774, 455/556.1, 455/575.1, 455/572
• US Class Current: 455/550.1
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: C23C 14/0031 Bombardment of substrates by reactive ion beams
• CPC Class Codes: C23C 14/0676 Oxynitrides
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: G02F 1/13306 Circuit arrangements or driving methods for the control of single liquid crystal cells G02F1/132, G02F1/133382 take precedence
• CPC Class Codes: G02F 1/13324 Circuits comprising solar cells
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/26 characterised by their structure, e.g. multi-layered, porosity or surface features
• CPC Class Codes: H01G 11/56 Solid electrolytes, e.g. gels; Additives therein
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 31/073 comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
• CPC Class Codes: H01L 31/1828 : the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• CPC Class Codes: H01M 10/0436 : Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/0472 : Vertically superposed cells with vertically disposed plates
• CPC Class Codes: H01M 10/052 : Li-accumulators
• CPC Class Codes: H01M 10/0525 : Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 10/0562 : Solid materials
• CPC Class Codes: H01M 10/058 : Construction or manufacture
• CPC Class Codes: H01M 10/0585 : of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 10/42 : Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells H01M10/60 takes precedence
• CPC Class Codes: H01M 10/425 : Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing printed circuits H05K1/00
• CPC Class Codes: H01M 10/4257 : Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 10/4264 : with capacitors
• CPC Class Codes: H01M 10/44 : Methods for charging or discharging circuits for charging H02J7/00
• CPC Class Codes: H01M 10/46 : Accumulators structurally combined with charging apparatus circuits for charging H02J7/00
• CPC Class Codes: H01M 10/465 : with solar battery as charging system
• CPC Class Codes: H01M 14/00 : Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
• CPC Class Codes: H01M 14/005 : Photoelectrochemical storage cells light sensitive devices H01G9/20, semiconductors sensitive to light H01L31/00
• CPC Class Codes: H01M 2004/021 : Physical characteristics, e.g. porosity, surface area
• CPC Class Codes: H01M 2008/1293 : Fuel cells with solid oxide electrolytes
• CPC Class Codes: H01M 4/0421 : involving vapour deposition
• CPC Class Codes: H01M 4/0423 : Physical vapour deposition
• CPC Class Codes: H01M 4/0426 : Sputtering
• CPC Class Codes: H01M 4/1391 : of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
• CPC Class Codes: H01M 4/1393 : of electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• CPC Class Codes: H01M 4/1397 : of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
• CPC Class Codes: H01M 4/382 : Lithium H01M4/405 takes precedence
• CPC Class Codes: H01M 4/405 : Alloys based on lithium
• CPC Class Codes: H01M 4/483 : for non-aqueous cells H01M4/485 takes precedence
• CPC Class Codes: H01M 4/581 : Chalcogenides or intercalation compounds thereof
• CPC Class Codes: H01M 4/5825 : Oxygenated metallic salts or polyanionic structures, e.g. borates, phosphates, silicates, olivines
• CPC Class Codes: H01M 4/587 : for inserting or intercalating light metals
• CPC Class Codes: H01M 4/8885 : Sintering or firing
• CPC Class Codes: H01M 4/9016 : Oxides, hydroxides or oxygenated metallic salts
• CPC Class Codes: H01M 50/103 : prismatic or rectangular H01M50/109, H01M50/11 take precedence
• CPC Class Codes: H01M 50/209 : adapted for prismatic or rectangular cells H01M50/216 takes precedence
• CPC Class Codes: H01M 50/403 : Manufacturing processes of separators, membranes or diaphragms
• CPC Class Codes: H01M 6/185 : with oxides, hydroxides or oxysalts as solid electrolytes
• CPC Class Codes: H01M 6/186 : Only oxysalts-containing solid electrolytes
• CPC Class Codes: H01M 6/188 : Processes of manufacture
• CPC Class Codes: H01M 6/40 : Printed batteries , e.g. thin film batteries
• CPC Class Codes: H01M 6/42 : Grouping of primary cells into batteries H01M6/40 takes precedence
• CPC Class Codes: H01M 8/1007 : with both reactants being gaseous or vaporised H01M8/12 takes precedence
• CPC Class Codes: H01M 8/1286 : Fuel cells applied on a support, e.g. miniature fuel cells deposited on silica supports
• CPC Class Codes: H04M 1/0262 : for a battery compartment
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: Y02E 10/543 : Solar cells from Group II-VI materials
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02E 60/13 : Energy storage using capacitors
• CPC Class Codes: Y02E 60/50 : Fuel cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 117/902 : Specified orientation, shape, crystallography, or size of seed or substrate
• CPC Class Codes: Y10T 29/49108 : Electric battery cell making
• CPC Class Codes: Y10T 29/49114 : including adhesively bonding
• CPC Class Codes: Y10T 29/49115 : including coating or impregnating
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53135 : Storage cell or battery

Abstract

A combined battery and wireless-communications apparatus and method. In some embodiments, the apparatus includes a support, a first conductive layer deposited on a first surface area of the support, a thin-film battery including a cathode layer, a solid-state electrolyte layer, and an anode layer deposited such that either the anode layer or the cathode layer is in electrical contact with the first conductive layer, an antenna mounted to the support structure, and an electronic communications circuit mounted to the support and electrically coupled to the battery and the antenna to transceive radio communications. Other embodiments include an energy-receiving device mounted to the support structure, and an electronic communications circuit mounted to the support structure and including a recharging circuit, the recharging circuit electrically coupled to the battery and the energy-receiving device to recharge the battery using energy received by the energy-receiving device.

Claims

1. An apparatus, comprising:

a thin-film battery affixed to a substrate;

an integrated circuit facing said thin-film battery, wherein the substrate is located between and affixed to both the integrated circuit and the thin-film battery;

at least one internal electrical connection that electrically connects the integrated circuit to the battery;

encapsulant material that encapsulates the integrated circuit, the thin-film battery, and the at least one internal electrical connection in a single package; and

a plurality of external electrical connections exposed external to the encapsulant material, wherein at least one of the plurality of external electrical connections is connected to the battery, and wherein at least one of the plurality of external electrical connections is connected to the integrated circuit.

2. The apparatus of claim 1, wherein the substrate includes a surface having a conductive trace and at least one dielectric layer present thereon, the thin-film battery being formed over at least a portion of the conductive trace and the at least one dielectric layer.

3. The apparatus of claim 1, further comprising an insulating layer located between the battery and the integrated circuit, wherein the insulating layer includes a pattern of vias, and wherein the at least one internal electrical connection is made through at least one of the vias.

4. The apparatus of claim 1, wherein the plurality of external electrical connections includes ball-grid-array connections that electrically connect the battery to the integrated circuit.

5. The apparatus of claim 1, wherein the plurality of external electrical connections includes ball-grid-array connections that electrically connect the integrated circuit to the substrate.

6. The apparatus of claim 1, wherein the plurality of external electrical connections includes at least one wire-lead connection that electrically connects the battery to the integrated circuit.

7. The apparatus of claim 1, wherein the plurality of external electrical connections includes at least one wire-lead connection that electrically connects the integrated circuit to the substrate.

8. The apparatus of claim 1, wherein the thin-film battery includes a plurality of individual cells located on an elongated strip that has fold lines, and wherein the elongated strip is folded successively along the fold lines to form a box of individual cells.

9. The apparatus of claim 1, wherein the battery includes an outside surface that is farthest from the integrated circuit, wherein the integrated circuit includes an outside surface that is farthest from the battery, and wherein the plurality of external electrical connections includes at least one wire-lead connection that electrically connects the outside surface of the battery to the outside surface of the integrated circuit.

10. The apparatus of claim 1, further comprising a capacitor, wherein the plurality of external connections includes at least one wire-lead connection that electrically connects the battery to the capacitor.

11. The apparatus of claim 1, wherein the at least one internal electrical connection that electrically connects the integrated circuit to the battery is connected to a surface of the integrated circuit that is between the battery and the integrated circuit and faces directly toward the battery and is connected to a surface of the battery that is between the battery and the integrated circuit and faces directly toward the integrated circuit.

12. A method comprising:

providing a substrate;

affixing a thin-film battery to the substrate;

providing an integrated circuit;

attaching the integrated circuit to the thin-film battery, wherein the integrated circuit faces the substrate such that the substrate is located between the integrated circuit and the thin-film battery,

electrically connecting at least one electrical terminal on a surface of the integrated circuit to at least one electrical terminal on a surface of the battery with an electrical conductor;

depositing encapsulant material that encapsulates the integrated circuit, the thin-film battery, and the at least one internal electrical connection in a single package;

providing a plurality of external electrical connections exposed external to the encapsulant material; and

electrically connecting at least one of the plurality of external electrical connections to the battery and electrically connecting at least one of the plurality of external electrical connections to the integrated circuit.

13. The method of claim 12, further comprising:

forming an insulating layer between the battery and the integrated circuit; and

creating a pattern of vias in the insulating layer, wherein the electrically connecting of the

at least one electrical terminal occurs through at least one of the vias.

14. The method of claim 12, wherein the providing of the plurality of external electrical connections includes providing ball-grid-array connections, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the battery to the integrated circuit using the ball-grid-array connections.

15. The method of claim 12, wherein the providing of the plurality of external electrical connections includes providing ball-grid-array connections, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the integrated circuit to the substrate using the ball-grid-array connections.

16. The method of claim 12, wherein the providing of the plurality of external electrical connections includes providing at least one wire-lead connection, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the battery to the integrated circuit using the at least one wire-lead connection.

17. The method of claim 12, wherein the providing of the plurality of external electrical connections includes providing at least one wire-lead connection, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the integrated circuit to the substrate using the at least one wire-lead connection.

18. The method of claim 12, wherein the affixing of the thin-film battery includes:

creating an elongated strip of individual cells that are deposited on the elongated strip as successive thin-film depositions,

successively folding the elongated strip along fold lines of the elongated strip to form a box of individual cells, and

affixing the box of individual cells to the substrate.

19. The method of claim 12, wherein the providing of the plurality of external electrical connections includes providing at least one wire-lead connection, wherein the battery includes an outside surface that is farthest from the integrated circuit, wherein the integrated circuit includes an outside surface that is farthest from the battery, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the outside surface of the battery to the outside surface of the integrated circuit using the at least one wire-lead connection.

20. The method of claim 12, further comprising providing a capacitor, wherein the providing of the plurality of external electrical connections includes providing at least one wire-lead connection, and wherein the electrically connecting of the at least one of the plurality of external electrical connections includes electrically connecting the battery to the capacitor using the at least one wire-lead connection.

21. The method of claim 12, wherein the surface of the integrated circuit to which the electrical conductor is connected is between the battery and the integrated circuit and faces directly toward the battery and the surface of the battery to which the electrical conductor is connected is between the battery and the integrated circuit and faces directly toward the integrated circuit.

22. An apparatus comprising:

a substrate;

an integrated circuit;

means for affixing a thin-film battery to the substrate;

means for attaching the integrated circuit to the thin-film battery, wherein the integrated circuit faces the substrate such that the substrate is located between the integrated circuit and the thin-film battery,

means for internally electrically connecting at least one electrical terminal on a surface of the integrated circuit to at least one electrical terminal on a surface of the battery;

means for encapsulating the integrated circuit, the thin-film battery, and the means for internally electrically connecting in encapsulant material, wherein the means for internally electrically connecting the at least one electrical terminal on the surface of the integrated circuit to the at least one electrical terminal on the surface of the battery is internal to the means for encapsulating; and

means for externally electrically connecting to the battery and means for externally electrically connecting to the integrated circuit, wherein the means for externally electrically connecting to the integrated circuit and the means for externally electrically connecting to the battery are each exposed external to the encapsulant material.

23. The apparatus of claim 22, wherein the surface of the integrated circuit to which the means for internally electrically connecting is connected is between the battery and the integrated circuit and faces directly toward the battery and the surface of the battery to which the means for internally electrically connecting is connected is between the battery and the integrated circuit and faces directly toward the integrated circuit.

24. An integrated circuit package apparatus, comprising:

an integrated circuit die;

a lead-frame;

a thin-film battery provided on a substrate;

an electrical connection between the integrated circuit die and the thin-film battery;

the integrated circuit die, the lead-frame, the thin-film battery and the electrical connection encapsulated together within encapsulant material wherein a plurality of external electrical connections to the apparatus are exposed external to the encapsulant material.

25. The apparatus of claim 24, wherein at least one of the plurality of external electrical connections is connected to the battery, and wherein at least one of the plurality of external electrical connections is connected to the integrated circuit.