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Methods for low cost manufacturing of complex layered materials and device

  • US 8,220,704 B2
  • Filed: 01/24/2007
  • Issued: 07/17/2012
  • Est. Priority Date: 01/24/2006
  • Status: Expired due to Fees
First Claim
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1. A process for manufacturing a microfluidic device, the process including a first processing that removes material followed by an embossing process, wherein the first processing improves the embossed structure replication;

  • wherein the first process removes the device material to form cut-outs that mate with the embossing tool during the embossing process to reduce the amount of displaced material during the embossing process;

    or wherein the first process removes the device material to form undercut layers that control the flow displaced material into the undercut areas during the embossing process.

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