Methods for low cost manufacturing of complex layered materials and device

• US 8,220,704 B2
• Filed: 01/24/2007
• Issued: 07/17/2012
• Est. Priority Date: 01/24/2006
• Status: Expired due to Fees

• Current Assignee: MycroLab Diagnostics Pty Ltd.
• Original Assignee: MycroLab Diagnostics Pty Ltd.
• Inventors: Atkin, Micah James, Eaton, Gregory Francis
• Primary Examiner(s): Trail, Allyson
• Application Number:
  US12/223,215
• Publication Number:
  US 20110028293A1
• Time in Patent Office: 2,001 Days
• Field of Search: 235/375, 235/492, 493/374, 426/106, 257/737
• US Class Current: 235/375
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B32B 2038/1891 Using a robot for handling the layers
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2310/14 Corona, ionisation, electrical discharge, plasma treatment
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 38/00 Ancillary operations in connection with laminating processes
• CPC Class Codes: B32B 38/0008 Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation heat treatment B32B38/0036
• CPC Class Codes: B32B 38/162 Cleaning
• CPC Class Codes: B32B 39/00 Layout of apparatus or plants, e.g. modular laminating systems
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: G06F 17/00 Digital computing or data processing equipment or methods, specially adapted for specific functions information retrieval, database structures or file system structures therefor G06F16/00

Abstract

A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and/or monitored. The modules may be interchangeable. One or more modules may receive and/or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

Claims

1. A process for manufacturing a microfluidic device, the process including a first processing that removes material followed by an embossing process, wherein the first processing improves the embossed structure replication;

wherein the first process removes the device material to form cut-outs that mate with the embossing tool during the embossing process to reduce the amount of displaced material during the embossing process;

or wherein the first process removes the device material to form undercut layers that control the flow displaced material into the undercut areas during the embossing process.