Housing comprising a housing underpart and method for emitting electromagnetic radiation
First Claim
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1. A housing comprising:
- a housing underpart;
a housing cavity defined within the housing underpart;
the housing cavity having an opening extending through one side of the housing;
at least one electromagnetic radiation emitting semiconductor chip disposed in the housing cavity; and
a transparent cover that covers the housing cavity, the cover connected to the housing underpart in such a way that the electromagnetic radiation exiting from the side surfaces of the cover is absorbedwherein the at least one electromagnetic radiation-emitting semiconductor chip is mounted in the housing cavity by means of an adhesive material and a gap is present between the at least one electromagnetic radiation-emitting semiconductor chip and the transparent cover.
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Abstract
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
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Citations
17 Claims
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1. A housing comprising:
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a housing underpart; a housing cavity defined within the housing underpart;
the housing cavity having an opening extending through one side of the housing;at least one electromagnetic radiation emitting semiconductor chip disposed in the housing cavity; and a transparent cover that covers the housing cavity, the cover connected to the housing underpart in such a way that the electromagnetic radiation exiting from the side surfaces of the cover is absorbed wherein the at least one electromagnetic radiation-emitting semiconductor chip is mounted in the housing cavity by means of an adhesive material and a gap is present between the at least one electromagnetic radiation-emitting semiconductor chip and the transparent cover. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A housing comprising:
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a housing underpart defining a single housing cavity within the housing underpart, the single housing cavity having an opening extending through one side of the housing; a plurality of electromagnetic radiation-emitting semiconductor chips disposed in the housing cavity ; and a transparent cover that covers the housing cavity, the cover being connected to the housing underpart in such a way that the electromagnetic radiation exiting from a side surface of the cover is absorbed wherein the at least one electromagnetic radiation-emitting semiconductor chip is mounted in the housing cavity by means of an adhesive material and a gap is present between the at least one electromagnetic radiation-emitting semiconductor chip and the transparent cover.
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Specification