Wireless telemetry electronic circuit package for high temperature environments

• US 8,220,990 B2
• Filed: 08/15/2008
• Issued: 07/17/2012
• Est. Priority Date: 08/15/2008
• Status: Active Grant

• Current Assignee: Cree Fayetteville, Inc. (Wolfspeed, Inc.)
• Original Assignee: Siemens Energy Incorporated (Siemens AG), Arkansas Power Electronics International, Inc. (Wolfspeed, Inc.)
• Inventors: Mitchell, David J., Kulkarni, Anand A., Subramanian, Ramesh, Roesch, Edward R., Waits, Rod, Schupbach, Roberto, Fraley, John R., Lostetter, Alexander B., McPherson, Brice, Western, Bryon
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): COURSON, TANIA C
• Application Number:
  US12/192,280
• Publication Number:
  US 20100039289A1
• Time in Patent Office: 1,432 Days
• Field of Search: 374/5, 374/29, 374/44, 374/57, 374/137, 374/141, 374/208, 361/739, 361/760, 174/250, 340/870.17
• US Class Current: 374/57
• CPC Class Codes: G01D 11/24 Housings ; Casings for instruments
• CPC Class Codes: H04Q 2209/40 using a wireless architecture
• CPC Class Codes: H04Q 2209/80 Arrangements in the sub-station, i.e. sensing device
• CPC Class Codes: H04Q 9/00 Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Abstract

A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.

Claims

1. A telemetry system for use in a high temperature environment comprising:

a stationary or moving part of a turbine;

a circuit assembly affixed to the part of the turbine and arranged to receive information sensed about a condition of the part of the turbine and transmit said received information to a receiver external to said environment, said circuit assembly being adapted for operation in the high temperature environment and comprising;

a high-temperature resistant package for housing said circuit assembly and being adapted for attachment to said part;

a PC board for supporting both active and passive components of said circuit assembly, said active components being fabricated with high temperature metallization;

a retainer affixed to an inside surface of said package for securing said PC board in place within the package; and

,

connectors attached to said PC board and passing through a wall of said package for supplying power to said circuit assembly and for communication with a sensor on said moving part and an antenna for transmitting data signals outside said environment, said data signals being indicative of the information sensed about the condition of said part.

2. The system as in claim 1 wherein said package is made of gold-plated Fe—

Ni—

Co alloy.

3. The system as in claim 1 wherein said PC board is made of alumina metalized with a thick film of gold paste deposited over said alumina thereby forming a conductive layer of said PC board.

4. The system as in claim 3 wherein said PC board comprises alumina of 10-100 mils thickness.

5. The system as in claim 3 wherein said PC board is made of 96% alumina measuring approximately 20 mils in thickness.

6. The system as in claim 1 wherein said retainer is a gold wire.

7. The system as in claim 1 wherein said active and passive components have a gold metallization layer on a surface thereof and are attached to gold metallization circuit traces on said PC board by means of a diffusion bonded gold powder.

8. The system as in claim 1 wherein said active components are electrically coupled to circuit traces on said PC board by means of gold bonding wire, wherein said gold bonding wire are oriented along an axis of the assembly in a direction parallel to the centrifugal forces exerted on said circuit assembly.

9. The system as in claim 7 wherein said gold bonding wire has a diameter within the range of 0.7 mil to 1.0 mil.

10. The system as in claim 7 wherein said gold bonding wire has a maximum loop height no greater than 17.4 mil.

11. The system as in claim 1 further comprising an electrically insulating sleeve secured around each of said connectors where they pass through the wall of said package.

12. An engine comprising:

an active telemetry circuit assembly affixed to a rotatable moving part of the engine, said assembly being capable of operation at temperatures exceeding 300 °

C. and capable of withstanding centrifugal forces along an axis of the assembly, the centrifugal forces exceeding 1000 gravitational forces, said circuit assembly comprising;

a high-temperature resistant package attachable to said moving part;

a high-temperature resistant PC board supporting both active and passive components of a telemetry circuit and having circuit traces printed thereon for interconnecting said components, said package being sized and adapted for receipt of said PC board; and

,

connectors passing through insulating sleeves in a wall of said package for providing power to said assembly, for communicating with sensors on said moving part and with an antenna for transmitting data signals outside said engine, said data signals being indicative of information sensed about a condition of said moving part.

13. The engine as in claim 12 wherein said PC board comprises alumina metallized with a thick film of gold paste deposited there over for forming a conductive layer of said PC board.

14. The engine as in claim 13 wherein said gold paste conductive layer is etched into a circuit pattern thereby forming circuit traces for said telemetry circuit turbine engine.

15. The engine as in claim 12 further comprising a retainer welded to an inside wall of said package for securing said PC board within said package.

16. The engine as in claim 15 wherein said retainer comprises a coefficient of thermal expansion within 20% of a coefficient of thermal expansion of the package.

17. The engine as in claim 15, wherein the retainer comprises a gold wire.

18. An active telemetry circuit assembly affixed to a moving part of an internal combustion engine, said circuit assembly comprising:

a high-temperature resistant gold-plated Fe—

Ni—

Co package attachable to said moving part of the internal combustion engine;

a high-temperature resistant PC board comprising an alumina substrate metallized with a thick film of gold paste deposited over said alumina substrate for forming a conductive layer and for supporting both active and passive components of said circuit assembly, said package being sized and adapted for receipt of said PC board;

a gold wire retainer welded to inside walls of said package for securing said PC board within said package; and

,

connectors passing through a wall of said package for providing power to said assembly and for communicating between sensors on said moving part and an antenna for transmitting data signals outside said engine, said data signals being indicative of the information sensed about the condition of said moving part, wherein said circuit assembly operates at temperatures exceeding 300 °

C. and is capable of withstanding centrifugal forces exceeding 1000 gravitational forces.

19. The assembly as in claim 18 wherein said gold paste conductive layer is deposited into a circuit pattern thereby forming said circuit traces for said telemetry circuit board assembly.

20. The system as in claim 18 wherein said active components are electrically coupled to circuit traces on said PC board by means of gold bonding wire, wherein said gold bonding wire are oriented along an axis of the assembly in a direction parallel to the centrifugal forces exerted on said circuit assembly during operation of the engine.