Adhesive composition
First Claim
1. An adhesive composition comprising a thermoplastic resin, a polyfunctional acrylate, a conductive particle for anisotropic conductive connection, and a radical polymerization initiator, wherein the adhesive composition further comprises a monofunctional urethane acrylate having a urethane residue at a terminal end, the monofunctional urethane acrylate being represented by the formula (1):
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CH2═
CR0—
COO—
R1—
NHCOO—
R2
(1)where R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
1 Assignment
0 Petitions
Accused Products
Abstract
An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1):
CH2═CR0—COO—R1—NHCOO—R2 (1)
wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
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Citations
6 Claims
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1. An adhesive composition comprising a thermoplastic resin, a polyfunctional acrylate, a conductive particle for anisotropic conductive connection, and a radical polymerization initiator, wherein the adhesive composition further comprises a monofunctional urethane acrylate having a urethane residue at a terminal end, the monofunctional urethane acrylate being represented by the formula (1):
-
CH2═
CR0—
COO—
R1—
NHCOO—
R2
(1)where R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification