Eliminate release etch attack by interface modification in sacrificial layers

• US 8,222,066 B2
• Filed: 04/02/2008
• Issued: 07/17/2012
• Est. Priority Date: 04/04/2007
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Tu, Thanh Nghia, Luo, Qi, Yang, Chia Wei, Heald, David, Gousev, Evgeni, Chiang, Chih-Wei
• Primary Examiner(s): Reames, Matthew
• Assistant Examiner(s): ULLAH, ELIAS
• Application Number:
  US12/061,592
• Publication Number:
  US 20080311690A1
• Time in Patent Office: 1,567 Days
• Field of Search: 438/52, 438/29, 257/E21.05
• US Class Current: 438/52
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00476 removing a sacrificial layer B81C1/00912 takes precedence

Abstract

Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.

Claims

1. A method of making a microelectromechanical system (MEMS) device, comprising:

forming a sacrificial layer over a substrate;

treating at least a portion of the sacrificial layer to form a treated sacrificial portion, wherein a substantial portion of the sacrificial layer remains after the treating and, wherein the treated sacrificial portion comprises an upper treated sacrificial layer, and a remaining portion of the sacrificial layer comprises a lower substantially untreated sacrificial layer;

forming an overlying layer over at least a part of the treated sacrificial portion; and

at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.

2. The method of claim 1, wherein the treating comprises oxidizing.

3. The method of claim 1, wherein the treating comprises exposing the sacrificial layer to one or more of nitrogen, fluorine, and chlorine.

4. The method of claim 1, wherein the cavity is an interferometric modulation cavity.

5. The method of claim 1, wherein the upper treated sacrificial layer is substantially uniform in depth as measured in a direction perpendicular to the substrate.

6. The method of claim 1, comprising removing at least a portion of the upper treated sacrificial layer and at least a portion of the lower substantially untreated sacrificial layer, wherein an etch rate of the upper treated sacrificial layer is greater than an etch rate of the lower substantially untreated sacrificial layer.

7. The method of claim 1, wherein the lower substantially untreated sacrificial layer comprises molybdenum.

8. The method of claim 7, wherein the upper treated sacrificial layer comprises a molybdenum oxide.

9. The method of claim 1, wherein the overlying layer comprises a metal.

10. The method of claim 9, wherein the metal comprises aluminum.

11. The method of claim 10, comprising selecting treatment conditions, for the treating of the sacrificial layer to form the treated sacrificial portion, to reduce hillock formation in the overlying aluminum layer subsequent to the at least partial removal of the treated sacrificial portion, the method further comprising exposing the MEMS device to an otherwise hillock-inducing condition subsequent to the at least partial removal of the treated sacrificial portion.

12. The method of claim 11, comprising selecting the treatment conditions to reduce the number of the hillocks.

13. The method of claim 11, comprising selecting the treatment conditions to reduce the size of the hillocks.

14. The method of claim 11, wherein the hillocks comprise heat-induced hillocks.

15. The method of claim 11, wherein the otherwise hillock-inducing condition comprises exposing the MEMS device to a temperature greater than about 100°

C.

16. The method of claim 11, wherein the otherwise hillock-inducing condition comprises exposing the MEMS device to a temperature greater than about 200°

C.

17. The method of claim 11, wherein the otherwise hillock-inducing condition comprises exposing the MEMS device to a temperature greater than about 500°

C.

18. The method of claim 1, comprising selecting treatment conditions, for the treating of the sacrificial layer to form the treated sacrificial portion, to increase a combined thickness of the upper treated sacrificial layer and the lower substantially untreated sacrificial layer, as compared to the sacrificial layer prior to the treating.

19. The method of claim 1, comprising selecting treatment conditions, for the treating of the sacrificial layer to form the treated sacrificial portion, to decrease the degree of adhesion between the overlying layer and the treated sacrificial portion during the at least partial removal of the treated sacrificial portion.

20. The method of claim 1, wherein the overlying layer comprises a passivation layer and an electrically conductive layer formed over the passivation layer, the passivation layer being configured to aid in allowing the treated sacrificial portion to separate from the electrically conductive layer during the at least partial removal of the treated sacrificial portion.

21. The method of claim 1, comprising selecting treatment conditions, for the treating of the sacrificial layer to form the treated sacrificial portion, to provide a surface of the treated sacrificial portion that is smoother than the surface of the sacrificial layer prior to the treatment.

22. The method of claim 21, wherein the treatment conditions comprise an N₂O or O₂ treatment, or both.

23. The method of claim 1, wherein the treating of the at least a portion of the sacrificial layer comprises exposing a surface of the sacrificial layer to oxygen-containing molecules or radicals.

24. The method of claim 23, wherein the oxygen comprises ionized oxygen.

25. The method of claim 1, wherein the treating of the at least a portion of the sacrificial layer comprises heating the sacrificial layer.

26. The method of claim 1, wherein the treating of the at least a portion of the sacrificial layer comprises exposing the sacrificial layer to a plasma.

27. The method of claim 1, comprising removing substantially all of the treated sacrificial portion.

28. The method of claim 1, further comprising:

treating a surface of the sacrificial layer by exposing the surface of the sacrificial layer to sulfur hexafluoride; and

forming the overlying layer over the sulfur hexafluoride-treated surface.

29. The method of claim 1, further comprising:

forming an electrode over the substrate; and

forming the sacrificial layer over the electrode,

wherein the cavity is situated between the electrode and the overlying layer.

30. The method of claim 29, further comprising forming an insulating layer over the electrode.

31. The method of claim 29, further comprising forming at least one support structure that separates the electrode and the overlying layer.

32. The method of claim 1 wherein said treating comprises exposing said at least a portion of the sacrificial layer to at least one selected from the group consisting of oxygen, nitrogen, fluorine, chlorine, silicon, sulfur hexafluoride, plasma, H₂O, and heat.