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Method and system for template assisted wafer bonding

  • US 8,222,084 B2
  • Filed: 05/20/2011
  • Issued: 07/17/2012
  • Est. Priority Date: 12/08/2010
  • Status: Active Grant
First Claim
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1. A method of fabricating a composite semiconductor structure, the method comprising:

  • providing an SOI substrate including a plurality of silicon-based devices;

    providing a compound semiconductor substrate including a plurality of photonic devices;

    dicing the compound semiconductor substrate to provide a plurality of photonic dies, each die including one or more of the plurality of photonics devices;

    providing an assembly substrate;

    mounting the plurality of photonic dies on predetermined portions of the assembly substrate;

    aligning the SOI substrate and the assembly substrate;

    joining the SOI substrate and the assembly substrate to form a composite substrate structure; and

    removing at least a portion of the assembly substrate from the composite substrate structure.

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