Method and system for template assisted wafer bonding
First Claim
1. A method of fabricating a composite semiconductor structure, the method comprising:
- providing an SOI substrate including a plurality of silicon-based devices;
providing a compound semiconductor substrate including a plurality of photonic devices;
dicing the compound semiconductor substrate to provide a plurality of photonic dies, each die including one or more of the plurality of photonics devices;
providing an assembly substrate;
mounting the plurality of photonic dies on predetermined portions of the assembly substrate;
aligning the SOI substrate and the assembly substrate;
joining the SOI substrate and the assembly substrate to form a composite substrate structure; and
removing at least a portion of the assembly substrate from the composite substrate structure.
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Accused Products
Abstract
A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.
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Citations
26 Claims
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1. A method of fabricating a composite semiconductor structure, the method comprising:
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providing an SOI substrate including a plurality of silicon-based devices; providing a compound semiconductor substrate including a plurality of photonic devices; dicing the compound semiconductor substrate to provide a plurality of photonic dies, each die including one or more of the plurality of photonics devices; providing an assembly substrate; mounting the plurality of photonic dies on predetermined portions of the assembly substrate; aligning the SOI substrate and the assembly substrate; joining the SOI substrate and the assembly substrate to form a composite substrate structure; and removing at least a portion of the assembly substrate from the composite substrate structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of growing a compound semiconductor structure on a silicon-based substrate, the method comprising:
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providing an SOI base wafer having a bonding surface; providing a seed wafer; dicing the seed wafer to provide a plurality of seed dies; providing a template wafer; mounting the plurality of seed dies on the template wafer; bonding the template wafer to the SOI base wafer, wherein the plurality of seed dies are joined to the bonding surface of the SOI base wafer; removing at least a portion of the template wafer; exposing at least a portion of a surface of the plurality of seed dies; and growing the compound semiconductor structure on the exposed seed dies. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification