LED package structure with fuse

• US 8,222,665 B2
• Filed: 08/13/2009
• Issued: 07/17/2012
• Est. Priority Date: 05/27/2009
• Status: Expired due to Fees

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Weng, Ssu-Yuan
• Primary Examiner(s): Pizarro, Marcos D.
• Assistant Examiner(s): Jahan, Bilkis
• Application Number:
  US12/540,380
• Publication Number:
  US 20100301374A1
• Time in Patent Office: 1,069 Days
• Field of Search: 257 98-100
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/483 Containers

Abstract

An LED package structure includes a lead frame, an LED chip disposed on the lead frame, a fuse disposed on the lead frame and electrically connected to the lead frame, and an encapsulation. The fuse is electrically connected to the LED chip in series.

Claims

1. A light emitting diode (LED) package structure, comprising:

a lead frame comprising a first lead pin, a second lead pin, and a loading part connected to the first lead pin;

an LED chip disposed on the loading part of the lead frame;

a fuse comprising an internal circuit and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and

an encapsulation covering the LED chip, the fuse and at least a part of the lead frame, wherein a positive electrode of the LED chip is electrically connected to a first electrode of the fuse, a second electrode of the fuse is electrically connected to the second lead pin of the lead frame, and a negative electrode of the LED chip is electrically connected to the first lead pin of the lead frame;

wherein the internal circuit comprising a substrate and a low melting point metal conductive pad disposed on the substrate, and the internal circuit is melted under a current greater than a current limit threshold.

2. The LED package structure of claim 1, wherein the fuse is a chip fuse.

3. The LED package structure of claim 1, further comprising a plurality of metal conductive wires to be configured to electrically connect the fuse, the LED chip and the lead frame.

4. The LED package structure of claim 1, wherein a negative electrode of the LED chip is electrically connected to a first electrode of the fuse, and a second electrode of the fuse is electrically connected to the second lead pin of the lead frame, and a positive electrode of the LED chip is electrically connected to the first lead pin of the lead frame.

5. The LED package structure of claim 1, wherein the fuse is disposed on the second lead pin of the lead frame.

6. The LED package structure of claim 1, wherein the fuse is disposed on the loading part of the lead frame.

7. The LED package structure of claim 1, wherein the fuse is disposed on the first lead pin of the lead frame.

8. A light emitting diode (LED) package structure, comprising:

a submount comprising a first conductive pin, a second conductive pin, and a loading part connected to the first conductive pin;

an LED chip disposed on the loading part of the submount;

a fuse comprising an internal circuit and electrically connected to the submount, the fuse being electrically connected to the LED chip in series; and

an encapsulation covering the LED chip, the fuse and at least a part of the submount, wherein a positive electrode of the LED chip is electrically connected to a first electrode of the fuse, a second electrode of the fuse is electrically connected to the second conductive pin of the submount, and a negative electrode of the LED chip is electrically connected to the first conductive pin of the submount;

wherein the internal circuit comprising a substrate and a low melting point metal conductive pad disposed on the substrate, and the internal circuit is melted under a current greater than a current limit threshold.

9. The LED package structure of claim 8, wherein the fuse is a chip fuse.

10. The LED package structure of claim 8, further comprising a plurality of metal conductive wires to be configured to electrically connect the fuse, the LED chip and the submount.

11. The LED package structure of claim 8, wherein a negative electrode of the LED chip is electrically connected to a first electrode of the fuse, and a second electrode of the fuse is electrically connected to the second conductive pin of the submount, and a positive electrode of the LED chip is electrically connected to the first conductive pin of the submount.

12. The LED package structure of claim 8, wherein the fuse is disposed on one of the first conductive pin and the second conductive pin of the submount.

13. The LED package structure of claim 8, wherein the fuse is disposed on the loading part of the submount.