LED package structure with fuse
First Claim
Patent Images
1. A light emitting diode (LED) package structure, comprising:
- a lead frame comprising a first lead pin, a second lead pin, and a loading part connected to the first lead pin;
an LED chip disposed on the loading part of the lead frame;
a fuse comprising an internal circuit and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and
an encapsulation covering the LED chip, the fuse and at least a part of the lead frame, wherein a positive electrode of the LED chip is electrically connected to a first electrode of the fuse, a second electrode of the fuse is electrically connected to the second lead pin of the lead frame, and a negative electrode of the LED chip is electrically connected to the first lead pin of the lead frame;
wherein the internal circuit comprising a substrate and a low melting point metal conductive pad disposed on the substrate, and the internal circuit is melted under a current greater than a current limit threshold.
2 Assignments
0 Petitions
Accused Products
Abstract
An LED package structure includes a lead frame, an LED chip disposed on the lead frame, a fuse disposed on the lead frame and electrically connected to the lead frame, and an encapsulation. The fuse is electrically connected to the LED chip in series.
-
Citations
13 Claims
-
1. A light emitting diode (LED) package structure, comprising:
-
a lead frame comprising a first lead pin, a second lead pin, and a loading part connected to the first lead pin; an LED chip disposed on the loading part of the lead frame; a fuse comprising an internal circuit and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series; and an encapsulation covering the LED chip, the fuse and at least a part of the lead frame, wherein a positive electrode of the LED chip is electrically connected to a first electrode of the fuse, a second electrode of the fuse is electrically connected to the second lead pin of the lead frame, and a negative electrode of the LED chip is electrically connected to the first lead pin of the lead frame; wherein the internal circuit comprising a substrate and a low melting point metal conductive pad disposed on the substrate, and the internal circuit is melted under a current greater than a current limit threshold. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A light emitting diode (LED) package structure, comprising:
-
a submount comprising a first conductive pin, a second conductive pin, and a loading part connected to the first conductive pin; an LED chip disposed on the loading part of the submount; a fuse comprising an internal circuit and electrically connected to the submount, the fuse being electrically connected to the LED chip in series; and an encapsulation covering the LED chip, the fuse and at least a part of the submount, wherein a positive electrode of the LED chip is electrically connected to a first electrode of the fuse, a second electrode of the fuse is electrically connected to the second conductive pin of the submount, and a negative electrode of the LED chip is electrically connected to the first conductive pin of the submount; wherein the internal circuit comprising a substrate and a low melting point metal conductive pad disposed on the substrate, and the internal circuit is melted under a current greater than a current limit threshold. - View Dependent Claims (9, 10, 11, 12, 13)
-
Specification