Semiconductor structure
First Claim
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1. A semiconductor structure, comprising:
- a substrate having a first area, a second area and a third area, wherein the second area is disposed between the first area and the third area;
at least one power metal-oxide-semiconductor field effect transistor (power MOSFET), disposed in the first area;
a floating diode or a body diode, disposed in the second area; and
at least one Schottky diode, disposed in the third area,wherein a first contact plug of the power MOSFET is electrically connected to a second contact plug of the Schottky diode by a metal layer, and the first contact plug is disposed in the substrate in the first area, andwherein the semiconductor device further comprises a trench gate disposed in the substrate, partially in the second area and partially in the third area, and the trench gate physically and electrically contacts the second contact plug.
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Abstract
A semiconductor structure including a substrate, at least one power MOSFET, a floating diode or a body diode, and at least one Schottky diode is provided. The substrate has a first area, a second area and a third area. The second area is between the first area and the third area. The at least one power MOSFET is in the first area. The floating diode or the body diode is in the second area. The at least one Schottky diode is in the third area. Further, the contact plugs of the power MOSFET and the Schottky diode include tungsten and are electronically connected to each other.
16 Citations
7 Claims
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1. A semiconductor structure, comprising:
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a substrate having a first area, a second area and a third area, wherein the second area is disposed between the first area and the third area; at least one power metal-oxide-semiconductor field effect transistor (power MOSFET), disposed in the first area; a floating diode or a body diode, disposed in the second area; and at least one Schottky diode, disposed in the third area, wherein a first contact plug of the power MOSFET is electrically connected to a second contact plug of the Schottky diode by a metal layer, and the first contact plug is disposed in the substrate in the first area, and wherein the semiconductor device further comprises a trench gate disposed in the substrate, partially in the second area and partially in the third area, and the trench gate physically and electrically contacts the second contact plug. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification