Integrated heat sink
First Claim
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1. An electronic device, comprising:
- a heat dissipating component located over a substrate;
an isolation trench formed in said substrate adjacent said component;
a contact region of said substrate bounded by said trench; and
an electrically isolated contact located over and in connected to said contact region, said electrically isolated contact and said contact region providing a thermally conductive path to the substrate.
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Abstract
An electronic device includes a heat dissipating component located over a substrate. An isolation trench is formed in the substrate adjacent the component. A contact region of the substrate is bounded by the trench. An electrically isolated contact is located over and in contact with the contact region. The electrically isolated contact and the contact region provide a thermally conductive path to the substrate.
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Citations
20 Claims
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1. An electronic device, comprising:
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a heat dissipating component located over a substrate; an isolation trench formed in said substrate adjacent said component; a contact region of said substrate bounded by said trench; and an electrically isolated contact located over and in connected to said contact region, said electrically isolated contact and said contact region providing a thermally conductive path to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming an electronic device, comprising:
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providing a substrate having a heat-dissipating component located thereover, an isolation trench adjacent said component, and a contact region of the substrate bounded by said trench; and locating an electrically isolated contact over and in contact with said contact region, said contact and said contact region providing a thermally conducting path to said substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification