Thermal interface members for removable electronic devices
First Claim
1. An apparatus, comprising:
- a printed circuit board configured to be coupled to an electronic device, a first surface of the printed circuit board including a thermally-conductive portion, a second surface of the printed circuit board including a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface; and
a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface, the portion of the thermal interface member being deformable and thermally-conductive,the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board, the second layer including at least one of a thermally-conductive gel, a thermally-conductive grease or a phase-change material having a phase-change temperature threshold of approximately 40 degrees Celsius.
1 Assignment
0 Petitions
Accused Products
Abstract
In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.
136 Citations
18 Claims
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1. An apparatus, comprising:
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a printed circuit board configured to be coupled to an electronic device, a first surface of the printed circuit board including a thermally-conductive portion, a second surface of the printed circuit board including a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface; and a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface, the portion of the thermal interface member being deformable and thermally-conductive, the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board, the second layer including at least one of a thermally-conductive gel, a thermally-conductive grease or a phase-change material having a phase-change temperature threshold of approximately 40 degrees Celsius. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An apparatus, comprising:
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a printed circuit board configured to be coupled to an electronic device; a frame coupled to a first surface of the printed circuit board, the frame defining, at least in part, an internal volume within which at least a portion of the electronic device can be disposed when the electronic device is removably coupled to the printed circuit board, the frame defining an opening; and a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is disposed within the opening, the thermal interface member being in contact with the electronic device when the portion of the electronic device is disposed within the internal volume, the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board, the second layer including at least one of a thermally-conductive gel, a thermally-conductive grease or a phase-change material having a phase-change temperature threshold of approximately 40 degrees Celsius. - View Dependent Claims (11, 12, 13)
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14. A method, comprising:
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disposing a first portion of a thermal interface member against a thermally-conductive portion of a first surface of a printed circuit board; coupling a second portion of the thermal interface member to the first surface of the printed circuit board via an adhesive, the first portion of the thermal interface member being mutually exclusive from the second portion of the thermal interface member, the printed circuit board including a second surface having a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface; and coupling a frame to the first surface of the printed circuit board such that a portion of the thermal interface member is disposed within an opening defined by the frame, the frame defining, at least in part, an internal volume within which at least a portion of an electronic device can be disposed. - View Dependent Claims (15, 16, 17)
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18. An apparatus, comprising:
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a printed circuit board configured to be coupled to an electronic device, a first surface of the printed circuit board including a thermally-conductive portion, a second surface of the printed circuit board including a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface; a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface, the portion of the thermal interface member being deformable and thermally-conductive; and a frame coupled to the first surface of the printed circuit board, the frame defining, at least in part, an internal volume within which at least a portion of the electronic device can be disposed when the electronic device is coupled to the printed circuit board, the frame defining an opening within which a portion of the thermal interface member is disposed such that the portion of the thermal interface member is in slidable contact with the electronic device.
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Specification