Feed through interconnect assembly for an implantable stimulation system and methods of making and using

• US 8,224,450 B2
• Filed: 09/18/2006
• Issued: 07/17/2012
• Est. Priority Date: 09/18/2006
• Status: Expired due to Fees

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Brase, Randall Lee
• Primary Examiner(s): Patel, Niketa
• Assistant Examiner(s): D ABREU, MICHAEL JOSEPH
• Application Number:
  US11/532,844
• Publication Number:
  US 20080071320A1
• Time in Patent Office: 2,129 Days
• Field of Search: 607/5, 607/36, 607/37
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

A stimulation system includes an implantable pulse generator having a sealed chamber and an electronic subassembly disposed in the sealed chamber. Feed through pins are coupled to the electronic subassembly and extend out of the sealed chamber. Feed through interconnects are coupled to the electronic subassembly via the feed through pins. At least one tab is disposed on at least one feed through interconnect. The tab(s) are configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin.

A feed through interconnect assembly includes an assembly frame; feed through interconnects extending from the assembly frame; a first contact pad and a second contact pad disposed on at least one of the feed through interconnects; and a tab formed on a first contact pad of at least one of the feed through interconnects.

Claims

1. A stimulation system comprising:

an implantable pulse generator comprising a sealed chamber and an electronic subassembly disposed in the sealed chamber;

a plurality of feed through pins coupled to the electronic subassembly and extending out of the sealed chamber;

a plurality of feed through interconnects disposed entirely external to the sealed chamber, the feed through interconnects coupled to the feed through pins such that the feed through interconnects are indirectly coupled to the electronic subassembly via the feed through pins, wherein each of the plurality of feed through interconnects is conductive;

at least one contact pad disposed on at least one of the feed through interconnects, wherein the at least one contact pad defines a coupling aperture having a first edge and an opposing second edge; and

at least one flexible tab at least partially disposed within the coupling aperture of the at least one contact pad, the at least one tab having a proximal end and a distal end, the proximal end attached to the first edge of the coupling aperture;

wherein for at least a first contact pad of the at least one contact pads a first feed through pin of the plurality of feed through pins extends through the coupling aperture of the first contact pad, wherein a first side of the first feed through pin contacts the distal end of the at least one tab as the distal end of the at least one tab flexes away from the contact pad and a second side of the first feed through pin, opposite to the first side, contacts the second edge of the coupling aperture.

2. The stimulation system of claim 1, further comprising a lead connector disposed on the implantable pulse generator and comprising a plurality of connector contacts.

3. The stimulation system of claim 1, wherein the number of tabs is equal to the number of feed through pins.

4. The stimulation system of claim 2, further comprising a lead having a proximal end and a distal end, wherein the proximal end of the lead is electrically coupleable to the lead connector, and wherein the distal end of the lead comprises one or more electrodes.

5. The stimulation system of claim 4, wherein the number of feed through pins is equal to the number of the one or more electrodes.

6. The stimulation system of claim 2, wherein each of the plurality of feed through interconnects extends from one of the plurality of feed through pins to the lead connector independently from the remaining feed through interconnects.

7. The stimulation system of claim 2, wherein the number of connector contacts is equal to the number of feed through pins.

8. The stimulation system of claim 1, wherein for each of the plurality of feed through interconnects the at least one contact pad has a width that is not equal to a width of the remaining portions of the feed through interconnect.

9. The stimulation system of claim 1, wherein the number of feed through interconnects is equal to the number of feed through pins.

10. The stimulation system of claim 2, wherein each of the plurality of feed through interconnects is coupled electrically to a different one of the plurality of connector contacts.