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Automated integrated solar cell production line composed of a plurality of automated modules and tools including an autoclave for curing solar devices that have been laminated

  • US 8,225,496 B2
  • Filed: 08/29/2008
  • Issued: 07/24/2012
  • Est. Priority Date: 08/31/2007
  • Status: Expired due to Fees
First Claim
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1. An automated integrated solar cell production line, comprising:

  • a substrate loading station to load substrates into the integrated production line that comprises a plurality of automation devices which are configured to serially transfer substrates along a path;

    a front contact isolation module disposed along the path and downstream from the substrate loading station, and adapted to etch a front contact layer deposited thereon to provide isolation therebetween;

    a plurality of cluster tools disposed along the path and downstream from the front contact isolation module, and having at least one processing chamber that is adapted to deposit a silicon-containing layer on a surface of the substrate;

    an interconnect formation module disposed along the path and downstream from the plurality of cluster tools, and adapted to etch the silicon-containing layer;

    one or more metal deposition chambers disposed along the path and downstream from the back contact isolation module, and adapted to deposit a metal layer over the silicon-containing layer;

    a back contact isolation module disposed along the path and downstream from the one or more metal deposition chambers;

    one or more edge deletion modules disposed along the path and downstream from the one or more metal deposition chambers that are adapted to remove material from a perimeter area of a substrate;

    a bonding wire attach module disposed along the path and downstream from the one or more material removal chambers;

    a lamination device disposed along the path and downstream from the bonding wire attach module that is adapted to bond a second substrate to the first substrate by applying heat and pressure to the first and second substrates which have the silicon-containing layer and a bonding layer disposed therebetween; and

    an autoclave disposed downstream from the lamination device, wherein the autoclave comprises;

    a vessel;

    a compressor that is in fluid communication with a processing region of the vessel and is adapted to expose the first substrate, second substrate and bonding layer to a gas at a pressure greater than 13 Bar;

    a heating element disposed in the processing region;

    a substrate support that is adapted to support a plurality of first and second substrates that have been bonded together in the processing region; and

    at least one spacer adapted to position each of the plurality of first and second substrates that have been bonded together in a spaced apart relationship during processing in the autoclave.

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