Substrate support with electrostatic chuck having dual temperature zones
First Claim
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1. An electrostatic chuck for receiving a substrate in a process chamber, the chuck comprising:
- (a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the backside surface comprising a plurality of spaced apart mesas;
(b) a plurality of heat transfer gas conduits traversing the ceramic puck and terminating in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface;
(c) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and
(d) first and second heater coils that are radially spaced apart, concentric about one another, and embedded in the ceramic puck, the first heater coil located at a peripheral portion of the ceramic puck and the second heater coil located at a central portion of the ceramic puck.
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Abstract
An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface and an opposing backside surface with a plurality of spaced apart mesas. An electrode is embedded in the ceramic puck to generate an electrostatic force to hold a substrate. Heater coils located at peripheral and central portions of the ceramic puck allow independent control of temperatures of the central and peripheral portions of the ceramic puck. The chuck is supported by a base having a groove with retained air. The chuck and base can also have an overlying edge ring and clamp ring.
248 Citations
34 Claims
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1. An electrostatic chuck for receiving a substrate in a process chamber, the chuck comprising:
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(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the backside surface comprising a plurality of spaced apart mesas; (b) a plurality of heat transfer gas conduits traversing the ceramic puck and terminating in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface; (c) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (d) first and second heater coils that are radially spaced apart, concentric about one another, and embedded in the ceramic puck, the first heater coil located at a peripheral portion of the ceramic puck and the second heater coil located at a central portion of the ceramic puck. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An electrostatic chuck for receiving a substrate in a process chamber, the chuck comprising:
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(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, a peripheral ledge, and an opposing backside surface, the opposing backside surface having a plurality of spaced apart mesas thereon; (b) a plurality of heat transfer gas conduits traversing the ceramic puck and terminating in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface; (c) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (d) first and second heater coils that are radially spaced apart, concentric about one another, and embedded in the ceramic puck, the first heater coil located at a peripheral portion of the ceramic puck and the second heater coil located at a central portion of the ceramic puck, the first and second heater coils being independently controllable. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. An electrostatic chuck comprising:
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(a) a ceramic puck comprising a substrate receiving surface comprising a plurality of raised plateaus separated by a pattern of grooves, an opposing backside surface comprising a plurality of spaced apart mesas, and a peripheral ledge having first and second steps; (b) a plurality of heat transfer gas conduits traversing the ceramic body and terminating in ports on the substrate receiving surface to provide heat transfer gas to the substrate receiving surface; (c) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (d) first and second heater coils embedded in the ceramic puck, the heater coils being radially spaced apart concentric about one another, and in the same plane, the first heater coil located at a peripheral portion of the ceramic puck and the second heater coil located at a central portion of the ceramic puck. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification