Mirror and mirror layer for optical modulator and method
First Claim
Patent Images
1. A method for fabricating a microelectromechanical systems (MEMS) device including a mirror comprising a mirror body, wherein a surface of the mirror body comprises a continuous reflective surface, the method comprising:
- depositing over a lower sacrificial layer the mirror body comprising the reflective surface, whereinthe mirror body comprises a body material and a sacrificial material, andthe sacrificial material is preferentially etchable over the body material;
depositing an upper sacrificial layer over the mirror body;
forming a mechanical layer over the upper sacrificial layer;
removing at least a substantial portion of the sacrificial material from the body;
removing the lower sacrificial layer; and
removing the upper sacrificial layer, wherein the MEMS device includes an optical stack with a gap formed between the mirror body and the optical stack, and wherein the mirror body is movable within the gap relative to the optical stack.
3 Assignments
0 Petitions
Accused Products
Abstract
Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The interferometric modulator disclosed herein comprises a movable mirror. Some embodiments of the disclosed movable mirror exhibit a combination of improved properties compared to known mirrors, including reduced moving mass, improved mechanical properties, and reduced etch times.
-
Citations
23 Claims
-
1. A method for fabricating a microelectromechanical systems (MEMS) device including a mirror comprising a mirror body, wherein a surface of the mirror body comprises a continuous reflective surface, the method comprising:
-
depositing over a lower sacrificial layer the mirror body comprising the reflective surface, wherein the mirror body comprises a body material and a sacrificial material, and the sacrificial material is preferentially etchable over the body material; depositing an upper sacrificial layer over the mirror body; forming a mechanical layer over the upper sacrificial layer; removing at least a substantial portion of the sacrificial material from the body; removing the lower sacrificial layer; and removing the upper sacrificial layer, wherein the MEMS device includes an optical stack with a gap formed between the mirror body and the optical stack, and wherein the mirror body is movable within the gap relative to the optical stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method for fabricating a microelectromechanical systems (MEMS) device comprising a mirror body, wherein a surface of the mirror body comprises a continuous reflective surface disposed on a surface of the mirror body, the method comprising:
-
depositing the mirror body comprising the reflective surface; etching a cavity in the mirror body; forming a deformable layer over the mirror body; securing the mirror body to the deformable layer with a connector; and releasing the mirror body to form a gap on a side of the mirror body opposite the deformable layer, wherein the gap is formed between the mirror body and an optical stack, wherein the deformable layer is capable of supporting the mirror body in a relaxed position and an actuated position. - View Dependent Claims (12, 13, 14, 15, 23)
-
-
16. A method for fabricating a microelectromechanical systems (MEMS) device including a mirror comprising a mirror body, wherein a surface of the mirror body comprises a continuous reflective surface, the method comprising:
-
forming the mirror body comprising the reflective surface, wherein the mirror body comprises a body material and a sacrificial material, and the sacrificial material is preferentially etchable over the body material; and treating at least a portion of the sacrificial material to convert the portion of the sacrificial material to a solid treated material within the mirror body, wherein the sacrificial material is selectively etchable over the treated material and the body material, wherein the MEMS device includes an optical stack with a gap formed between the mirror body and the optical stack, and wherein the mirror body is movable within the gap relative to the optical stack. - View Dependent Claims (17, 18, 19, 20, 21, 22)
-
Specification