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Packaging method of wafer level chips

  • US 8,227,271 B1
  • Filed: 06/22/2011
  • Issued: 07/24/2012
  • Est. Priority Date: 01/27/2011
  • Status: Expired due to Fees
First Claim
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1. A packaging method of wafer level chips, comprising:

  • providing a plurality of chips attached on a first film, wherein the chips on the first film are disposed respectively corresponding to a plurality of electrode patterns of a substrate, and a base surface of each of the chips is contacted with the first film;

    respectively forming a phosphor layer on at least one surface of each of the chips;

    disposing a second film on the phosphor layers, and the second film being opposite to the first film;

    removing the first film from the base surface of each of the chips;

    attaching the base surfaces of the chips to the substrate;

    electrically connecting each of the chips with the corresponding electrode pattern through a wire bonding; and

    providing a packaging gel to encompass each of the chips, and solidifying the packaging gel.

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