Light emitting diode apparatus

• US 8,227,822 B2
• Filed: 10/13/2009
• Issued: 07/24/2012
• Est. Priority Date: 12/25/2008
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Hung, Chun Chang, Shao, Tung Liang, Lin, Falcon
• Primary Examiner(s): HO, HOANG QUAN TRAN
• Application Number:
  US12/577,895
• Publication Number:
  US 20100163898A1
• Time in Patent Office: 1,015 Days
• Field of Search: None
• US Class Current: 257/98
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133606 including a specially adapted diffusing, scattering or light controlling members
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting diode apparatus comprises a substrate having a circuit pattern, a reflection layer disposed on the substrate, at least one light emitting element disposed on the reflection layer, a reflector disposed around the at t one light emitting element, a sealing material formed over the at least one light emitting element and a phosphor layer disposed over the sealing material. The light emitting element comprises a conductive portion electrically coupled to the circuit pattern. In one embodiment, a plurality of light emitting elements are linearly arrayed, and a spacer is disposed between every two adjacent light emitting elements.

Claims

1. A light emitting diode apparatus, comprising:

a substrate having a circuit pattern;

a reflection layer disposed on the substrate and the circuit pattern;

at least one light emitting element having a conductive portion and disposed on the reflection layer, wherein the circuit pattern is electrically coupled to the conductive portion of the at least one light emitting element so that power is transmitted to the at least one light emitting element;

a reflector formed on the reflection layer and surrounding the at least one light emitting element comprising a light emitting opening of the reflector and a first reflection surface disposed within the interior of the reflector, wherein the reflection layer is between the substrate and the reflector;

a sealing material disposed around the at least one light emitting element; and

a phosphor layer disposed on the sealing material and configured to provide uniformly mixed light.

2. The light emitting diode apparatus of claim 1, further comprising an optical microstructure film, wherein the phosphor layer is disposed on the light emitting opening and attached to the optical microstructure film.

3. The light emitting diode apparatus of claim 1, wherein a gap is formed between the sealing material and the phosphor layer.

4. The light emitting diode apparatus of claim 1, further comprising an optical microstructure film disposed on the light emitting opening, wherein the phosphor layer is received within the reflector.

5. The light emitting diode apparatus of claim 4, wherein a gap separates the optical microstructure film and the phosphor layer.

6. The light emitting diode apparatus of claim 1, wherein the at least one light emitting element comprises a plurality of arrayed light emitting elements.

7. The light emitting diode apparatus of claim 6, wherein the plurality of light emitting elements are linearly arrayed, and a spacer having a second reflection surface is disposed between every two adjacent light emitting elements.

8. The light emitting diode apparatus of claim 6, wherein the plurality of light emitting elements are arrayed in a matrix, and a spacer having a second reflection surface is disposed between every two adjacent rows of the light emitting elements.

9. The light emitting diode apparatus of claim 6, further comprising a grid-like spacer having a second reflection surface, wherein the light emitting elements are separated from one another by the grid-like spacer, with the second reflection surface facing the light emitting elements.

10. The light emitting diode apparatus of claim 9, wherein an angle between the first reflection surface and the substrate is between 30°

and 80°

, and an angle between the second reflection surface and the substrate is between 15° and

80°

.

11. The light emitting diode apparatus of claim 8, wherein an angle between the first reflection surface and the substrate is between 30°

and 80°

, and an angle between the second reflection surface and the substrate is between 15° and

80°

.

12. The light emitting diode apparatus of claim 7, wherein an angle between the first reflection surface and the substrate is between 30°

and 80°

, and an angle between the second reflection surface and the substrate is between 15° and

80°

.

13. The light emitting diode apparatus of claim 1, wherein the reflection layer comprises at least one opening, and the circuit pattern is electrically coupled to the conductive portion by a wire through the at least one opening to provide power to the at least one light emitting element.

14. The light emitting diode apparatus of claim 1, wherein the sealing material includes a surface having an optical microstructure.