Alignment for backside illumination sensor
First Claim
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1. An apparatus, comprising:
- an integrated circuit located in a first region of a substrate having first and second opposing major surfaces; and
an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces, wherein the alignment mark protrudes from one of the first and second surfaces.
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Abstract
Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
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Citations
20 Claims
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1. An apparatus, comprising:
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an integrated circuit located in a first region of a substrate having first and second opposing major surfaces; and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces, wherein the alignment mark protrudes from one of the first and second surfaces. - View Dependent Claims (2, 3, 4, 5, 20)
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6. An apparatus, comprising:
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a first substrate having first and second opposing major surfaces, the first substrate including; at least one transistors located in a first region of the first surface, and at least one recess located in a second region of the first surface, wherein the at least one recess is filled with a material; and a second substrate coupled to the first substrate such that the first surface of the first substrate is closer to the second substrate relative to the second surface of the first substrate; wherein the material in the at least one recess is exposed through the second surface of the first substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. An apparatus, comprising:
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a first semiconductor substrate having a frontside surface and a backside surface; a first layer formed over the frontside surface of the first semiconductor substrate; a first recess formed through the first layer and extending into the first substrate to a first depth;
wherein the first recess is filled with a material;a second recess formed through the first layer and extending into the first substrate to a second depth, wherein the second depth is substantially less than the first depth, wherein the second recess is filled with the material; a second layer formed over the material in the first and second recesses; and a second semiconductor substrate coupled to the first semiconductor substrate such that the first and second substrates are separated by at least a portion of at least the second layer; wherein the material in the first recess is exposed through the backside surface of the first substrate. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification