Integrated circuit packaging system with interposer
First Claim
Patent Images
1. An integrated circuit packaging system comprising:
- a base package substrate;
a first integrated circuit die attached over the base package substrate; and
an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
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Abstract
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
30 Citations
10 Claims
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1. An integrated circuit packaging system comprising:
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a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification