Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same

• US 8,228,075 B2
• Filed: 02/19/2009
• Issued: 07/24/2012
• Est. Priority Date: 08/24/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kato, Noboru
• Primary Examiner(s): Nguyen, Vincent Q
• Application Number:
  US12/388,826
• Publication Number:
  US 20090153332A1
• Time in Patent Office: 1,251 Days
• Field of Search: 324/754.01, 324/754.03, 324/652, 324/72.5
• US Class Current: 324/652
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/06788 Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments end pieces terminating in a probe H01R11/18
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G06K 19/0722 comprising an arrangement for testing the record carrier

Abstract

A test system for a radio frequency IC device includes a radio frequency IC chip and a radiation strip. The characteristics of the radio frequency IC device are measured by bringing the tip of a probe of a test apparatus in direct contact with a portion of the radiation strip and thereby providing a radio frequency signal. The tip of the probe is made to be a flat plate so as to obtain closer and more stable contact with the radiation strip.

Claims

1. A method of manufacturing a radio frequency IC device that includes a radio frequency IC chip and a radiation strip comprising the steps of:

providing a test apparatus including a probe; and

measuring a characteristic of the radio frequency IC device by bringing the probe of the test apparatus into direct contact with a portion of the radiation strip;

wherein

the radio frequency IC chip is directly or indirectly provided on the radiation strip during the measuring step.

2. The method of manufacturing a radio frequency IC device according to claim 1, wherein the probe is brought into contact with an open end of the radiation strip.

3. The method of manufacturing a radio frequency IC device according to claim 1, wherein the radio frequency IC device includes the radio frequency IC chip mounted thereon and a feed circuit substrate including a resonant circuit having an inductor element, and the feed circuit substrate is electromagnetically coupled with the radiation strip.

4. The method of manufacturing a radio frequency IC device according to claim 1, wherein a tip of the probe is a flat plate, and the tip of the probe is brought into contact with the radiation strip.

5. The method of manufacturing a radio frequency IC device according to claim 1, wherein a tip portion of the probe has elasticity, and the tip of the probe is brought into contact with the radiation strip.

6. The method of manufacturing a radio frequency IC device according to claim 5, wherein the tip portion of the probe is coil-shaped.