×

Endoscope apparatus

  • US 8,228,369 B2
  • Filed: 03/24/2009
  • Issued: 07/24/2012
  • Est. Priority Date: 03/31/2008
  • Status: Active Grant
First Claim
Patent Images

1. An endoscope apparatus comprisinga polygonal camera module prepared as one of a plurality of polygonal camera modules, the plurality of polygonal camera modules being integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the plurality of polygonal camera modules integrally formed at the wafer level into individual polygonal camera modules,wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×