Endoscope apparatus
First Claim
1. An endoscope apparatus comprisinga polygonal camera module prepared as one of a plurality of polygonal camera modules, the plurality of polygonal camera modules being integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the plurality of polygonal camera modules integrally formed at the wafer level into individual polygonal camera modules,wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.
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Accused Products
Abstract
An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.
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Citations
7 Claims
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1. An endoscope apparatus comprising
a polygonal camera module prepared as one of a plurality of polygonal camera modules, the plurality of polygonal camera modules being integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the plurality of polygonal camera modules integrally formed at the wafer level into individual polygonal camera modules, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.
Specification