Small form factor USB bluetooth dongle
First Claim
Patent Images
1. A small form factor universal serial bus (USB) dongle comprising:
- a printed circuit board (PCB) having a first surface and an opposing second surface;
a USB contact area on the first surface of the PCB; and
a radio frequency (RF) transceiver die mounted on the opposing second surface of the PCB, wherein at least a substantial portion of the RF transceiver die resides directly opposite the USB contact area.
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Abstract
A small form factor USB Bluetooth dongle includes a printed circuit board (PCB), a USB contact area, and a radio frequency (RF) transceiver die. The PCB includes a first primary surface and a second primary surface. The USB contact area is fabricated on the first primary surface. The RF transceiver die is mounted on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.
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Citations
24 Claims
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1. A small form factor universal serial bus (USB) dongle comprising:
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a printed circuit board (PCB) having a first surface and an opposing second surface; a USB contact area on the first surface of the PCB; and a radio frequency (RF) transceiver die mounted on the opposing second surface of the PCB, wherein at least a substantial portion of the RF transceiver die resides directly opposite the USB contact area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A small form factor universal serial bus (USB) wireless communication dongle comprising:
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a circuit board having a first primary surface lying in a first plane, and a second primary surface lying in a second plane substantially parallel to the first plane;
a USB contact area on the first primary surface; anda radio frequency (RF) transceiver die on the second primary surface, wherein at least a portion of the RF transceiver die resides directly opposite the USB contact area. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A small form factor universal serial bus (USB) dongle comprising:
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a printed circuit board (PCB) having a first primary surface and a second primary surface on different faces of the PCB; a USB contact area on the first primary surface and a secondary area on the first primary surface, the second area being separate from and adjacent to the USB contact area; and a radio frequency (RF) transceiver die positioned on the second primary surface, such that at least a portion of the RF transceiver die and the USB contact area are directly opposite one another. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification