N-channel SONOS non-volatile memory for embedded in logic

• US 8,228,726 B2
• Filed: 10/18/2010
• Issued: 07/24/2012
• Est. Priority Date: 12/14/2008
• Status: Active Grant

• Current Assignee: Chipmos Technologies Incorporated (Chipmos)
• Original Assignee: Chipmos Technologies Incorporated (Chipmos)
• Inventors: Fang, Gang-Feng, Leung, Wingyu
• Primary Examiner(s): MAI, SON LUU
• Application Number:
  US12/906,153
• Publication Number:
  US 20110032766A1
• Time in Patent Office: 645 Days
• Field of Search: 365/185.01
• US Class Current: 365/185.01
• CPC Class Codes: G11C 16/0466 comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] G11C16/0483, G11C16/0491 take precedence
• CPC Class Codes: G11C 16/28 using differential sensing or reference cells, e.g. dummy cells
• CPC Class Codes: H10B 43/10 characterised by the top-view layout
• CPC Class Codes: H10B 43/30 characterised by the memory core region
• CPC Class Codes: H10B 43/40 characterised by the peripheral circuit region

Abstract

A system and method of an electrically programmable and erasable non-volatile memory cell fabricated using a single-poly, logic process with the addition of ONO deposition and etching is disclosed. In one embodiment, a non-volatile memory system includes at least one non-volatile memory cell consists of a SONOS transistor fabricated on a P substrate, with a deep N-well located in the P substrate, with a P-well located in the deep N-well. The memory cell further includes an access NMOS transistor, coupled to the SONOS transistor and located in the same P-well that includes an oxide only gate-dielectric. The cell can be fabricated in a modified logic process with other transistors and with their physical characteristics preserved.

Claims

1. A non-volatile memory cell embedded in common logic, the cell comprising:

an n-doped layer of silicon;

a P-well disposed on the n-doped layer; and

an n-channel Metal Oxide Semiconductor (NMOS) transistor with an Oxide-Nitride-Oxide (ONO) gate dielectric disposed in the P-well, the NMOS transistor comprising;

a source;

a drain;

a channel region disposed between the source and the drain; and

one of a poly-silicon and a metal control gate disposed on the ONO gate dielectric to result in one of a SONOS and a MONOS transistor, respectively, the control gate being configured to be selectively coupled to a positive bias and one of the source and the drain being configured to be selectively coupled to a negative bias during a program operation, and the positive and negative biases being less than a maximum voltage limit of input/output (I/O) transistors used in the common logic.

2. The non-volatile memory cell of claim 1, further comprising:

an under-lapped source region disposed between the channel region and the source.

3. The non-volatile memory cell of claim 1, wherein the ONO gate dielectric comprises:

a blocking oxide layer underlying the control gate;

a nitride layer underlying the blocking oxide layer; and

a tunneling oxide layer underlying the nitride layer and overlying the P-well.

4. The non-volatile memory of claim 1, wherein the n-doped layer is a deep N-well disposed in a P-substrate.

5. The non-volatile memory cell of claim 1, wherein the n-doped layer is an N-substrate.

6. The non-volatile memory cell of claim 2, further comprising an under-lapped drain region disposed between the channel region and the drain.

7. The non-volatile memory cell of claim 1, wherein the control gate is configured to be selectively coupled to the negative bias and the one of the source and the drain is configured to be selectively coupled to the positive bias during an erase operation.

8. The non-volatile memory cell of claim 1, further comprising:

an access transistor having a source coupled to the drain of the SONOS transistor.

9. A method comprising:

fabricating a non-volatile memory cell along with at least one other device utilizing a single additional gate-dielectric mask, the fabrication process of the non-volatile memory cell comprising;

creating an n-doped layer in a silicon substrate;

creating a p-well in the n-doped layer;

creating an NMOS transistor in the p-well, the NMOS transistor including a source and a drain on either side of a channel region thereof; and

creating an ONO gate dielectric overlying the p-well.

10. The method of claim 9, further comprising:

depositing a single-layer of one of a poly-silicon and a metal simultaneously on the gate dielectric of the NMOS transistor and on the gate dielectric of logic transistors.

11. The method of claim 9, further comprising:

disposing an under-lapped source region between the channel region and the source; and

disposing an under-lapped drain region between the channel region and the drain.

12. The method of claim 9, further comprising:

blocking deposition of a lightly-doped diffusion implant on either side of the channel region so as to create a more abrupt source and drain junction between the channel region and an N+ region of the source and between the channel region and an N+ region of the drain.

13. The method of claim 9, wherein creating the ONO gate dielectric comprises:

depositing a tunnel oxide layer overlying the p-well;

depositing a nitride layer overlying the tunnel oxide layer; and

depositing a blocking oxide layer overlying the nitride layer.

14. A method comprising:

creating a non-volatile memory cell through;

creating an N-well in a P-type silicon substrate;

creating a P-well in the N-well;

creating an NMOS transistor in the P-well, the NMOS transistor including a source and a drain on either side of a channel region thereof; and

creating an ONO gate dielectric overlying the P-well;

creating common logic components on the same substrate as the non-volatile memory cell through at least all steps required in a same common logic process; and

utilizing a single additional gate-dielectric mask to mask the common logic components to mask deposition of the ONO gate dielectric.

15. The method of claim 14, further comprising:

depositing a single-layer of one of a poly-silicon and a metal on the gate dielectric to form a gate for each of the transistors simultaneously.

16. The method of claim 14, further comprising:

disposing an under-lapped source region between the channel region and the source; and

disposing an under-lapped drain region between the channel region and the drain.

17. The method of claim 14, further comprising providing an access transistor having a source coupled to the drain of the NMOS transistor.

18. The method of claim 14, further comprising:

blocking deposition of a lightly-doped diffusion implant on either side of the channel region so as to create a more abrupt source and drain junction between the channel region and an N+ region of the source and between the channel region and an N+ region of the drain.

19. The method of claim 14, wherein creating the ONO gate dielectric comprises:

depositing a tunnel oxide layer overlying the P-well;

depositing a nitride layer overlying the tunnel oxide layer; and

depositing a blocking oxide layer overlying the nitride layer.

20. The method of claim 14, further comprising:

arranging the non-volatile memory cell along with other non-volatile memory cells in rows and columns to form a memory array.

21. An integrated circuit comprising:

at least one logic component having a gate; and

a non-volatile memory cell coupled to the at least one logic component, the non-volatile memory cell also including a gate, the gate of the at least one logic component and the gate of the non-volatile memory cell each having one of;

a poly-silicon and a metal common single-layer gate structure, the logic component being created on a same substrate as the non-volatile memory cell through at least all steps required in a common logic process, and a single additional gate-dielectric mask being utilized to create the non-volatile memory cell.

22. The integrated circuit of claim 21, wherein the non-volatile memory cell further comprises an under-lapped source region of a transistor thereof disposed between a channel region and a source of the transistor and an under-lapped drain region of the transistor disposed between the channel region and a drain of the transistor.

23. The integrated circuit of claim 21,

wherein the non-volatile memory cell is disposed in a P-well that is, in turn, disposed on an n-doped layer of silicon,

wherein the non-volatile memory cell includes an ONO gate dielectric disposed on the P-well, and

wherein the non-volatile memory cell includes a drain and a source coupled by a channel region.

24. The integrated circuit of claim 23, further comprising:

an access transistor coupled to the non-volatile memory cell to reduce any disturbance from an erase or a read operation on the non-volatile memory cell, the drain of the non-volatile memory cell being coupled to a source of the access transistor.

25. The integrated circuit of claim 21, wherein the non-volatile memory cell and other non-volatile memory cells thereof are arranged in rows and columns to form a memory array.

26. The integrated circuit of claim 25, further comprising:

a bit line coupled to a drain of each non-volatile memory cell located in a given column;

a common line coupled to a source of the each non-volatile memory cell in the given column; and

a word line coupled to a gate of each access transistor of the non-volatile memory cells in a given row.

27. The integrated circuit of claim 23, wherein the non-volatile memory cell is located in at least one configuration comprising:

a common deep P-well, and a common n-doped layer.

28. A method of fabricating an integrated circuit having common logic and non-volatile memory, the method comprising:

creating an n-doped layer in a silicon substrate;

creating a p-well in the n-doped layer;

creating a source and a drain region for transistors in both the common logic and the non-volatile memory using a common logic process;

creating an ONO gate dielectric for the non-volatile memory using a single additional gate-dielectric mask; and

utilizing a same logic process to fabricate both the common logic and the non-volatile memory, except for the utilization of the single additional gate-dielectric mask.

29. The method of claim 28, further comprising:

depositing concurrently a single-layer of;

one of a poly-silicon and a metal as a gate for both transistors of the common logic and transistors of the non-volatile memory using the common logic process.