MEMS microphone, production method and method for installing
First Claim
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1. A microphone in a miniaturized form, comprising:
- a flat carrier substrate having a first recess extending through the carrier substrate,a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess, anda cap on a second surface opposite the first surface, the cap being configured to form a tight seal with the second surface and span the first recess, the cap comprising at least one metallic layer for electromagnetic shielding.
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Abstract
A microphone in a miniaturized form is described herein. The microphone includes a flat carrier substrate having a first recess extending through the carrier substrate. The microphone includes a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess. The microphone also includes a cap on a second surface opposite the first surface having a tight seal with the second surface and spanning the first recess. The cap includes at least one metallic layer for electromagnetic shielding.
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Citations
12 Claims
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1. A microphone in a miniaturized form, comprising:
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a flat carrier substrate having a first recess extending through the carrier substrate, a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess, and a cap on a second surface opposite the first surface, the cap being configured to form a tight seal with the second surface and span the first recess, the cap comprising at least one metallic layer for electromagnetic shielding. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification